28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA -40 to 85
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
零件包装代码 | BGA |
包装说明 | TFBGA, BGA176,8X22,25 |
针数 | 176 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
Factory Lead Time | 1 week |
系列 | SSTU |
JESD-30 代码 | R-PBGA-B176 |
JESD-609代码 | e1 |
长度 | 15 mm |
逻辑集成电路类型 | D FLIP-FLOP |
最大频率@ Nom-Su | 410000000 Hz |
最大I(ol) | 0.012 A |
湿度敏感等级 | 3 |
位数 | 28 |
功能数量 | 1 |
端子数量 | 176 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出特性 | OPEN-DRAIN |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TFBGA |
封装等效代码 | BGA176,8X22,25 |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH |
包装方法 | TR |
峰值回流温度(摄氏度) | 260 |
电源 | 1.8 V |
Prop。Delay @ Nom-Su | 1 ns |
传播延迟(tpd) | 3 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 1.9 V |
最小供电电压 (Vsup) | 1.7 V |
标称供电电压 (Vsup) | 1.8 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 | BALL |
端子节距 | 0.65 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
触发器类型 | POSITIVE EDGE |
宽度 | 6 mm |
最小 fmax | 410 MHz |
Base Number Matches | 1 |
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