Registers DDR II REGISTER
| 参数名称 | 属性值 |
| Brand Name | Integrated Device Technology |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | CABGA |
| 包装说明 | BGA, BGA96,6X16,32 |
| 针数 | 96 |
| 制造商包装代码 | BFG96 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 其他特性 | 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE |
| 系列 | SSTU |
| JESD-30 代码 | R-PBGA-B96 |
| JESD-609代码 | e1 |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 湿度敏感等级 | 3 |
| 位数 | 25 |
| 功能数量 | 1 |
| 端子数量 | 96 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装等效代码 | BGA96,6X16,32 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.8 V |
| 传播延迟（tpd） | 2.35 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 1.9 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 |
| 触发器类型 | POSITIVE EDGE |
| 最小 fmax | 340 MHz |
| Base Number Matches | 1 |
| 74SSTU32864GBFG | 74SSTU32864CBFG8 | 74SSTU32864GBFG8 | 74SSTU32864DBFG8 | 74SSTU32864BFG8 | 74SSTU32864BFG | 74SSTU32864DBFG | |
|---|---|---|---|---|---|---|---|
| 描述 | Registers DDR II REGISTER | Registers DDR II REGISTER | Registers DDR II REGISTER | Registers 1:1 and 1:2 Registered Buffer with 1.8V SSTL I/O | Registers DDR II REGISTAR | Registers DDR II REGISTAR | Registers 1:1 and 1:2 Registered Buffer with 1.8V SSTL I/O |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | CABGA | CABGA | CABGA | CABGA | CABGA | CABGA | CABGA |
| 包装说明 | BGA, BGA96,6X16,32 | GREEN, LFBGA-96 | BGA, BGA96,6X16,32 | BGA, BGA96,6X16,32 | BGA, BGA96,6X16,32 | BGA, BGA96,6X16,32 | BGA, BGA96,6X16,32 |
| 针数 | 96 | 96 | 96 | 96 | 96 | 96 | 96 |
| 制造商包装代码 | BFG96 | BFG96 | BFG96 | BFG96 | BFG96 | BFG96 | BFG96 |
| Reach Compliance Code | compliant | compliant | compliant | unknown | compliant | compliant | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE | 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE | 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE | 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE | 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE | 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE | 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE |
| 系列 | SSTU | SSTU | SSTU | SSTU | SSTU | SSTU | SSTU |
| JESD-30 代码 | R-PBGA-B96 | R-PBGA-B96 | R-PBGA-B96 | R-PBGA-B96 | R-PBGA-B96 | R-PBGA-B96 | R-PBGA-B96 |
| JESD-609代码 | e1 | e1 | e1 | e1 | e1 | e1 | e1 |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 位数 | 25 | 25 | 25 | 25 | 25 | 25 | 25 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 96 | 96 | 96 | 96 | 96 | 96 | 96 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 封装等效代码 | BGA96,6X16,32 | BGA96,6X16,32 | BGA96,6X16,32 | BGA96,6X16,32 | BGA96,6X16,32 | BGA96,6X16,32 | BGA96,6X16,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 传播延迟（tpd） | 2.35 ns | 2.35 ns | 2.35 ns | 2.35 ns | 2.35 ns | 2.35 ns | 2.35 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 最小 fmax | 340 MHz | 340 MHz | 340 MHz | 340 MHz | 340 MHz | 340 MHz | 340 MHz |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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