Buffer Amplifier, 1 Func, BIPolar, CDIP8,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
Reach Compliance Code | unknown |
放大器类型 | BUFFER |
标称带宽 (3dB) | 100 MHz |
25C 时的最大偏置电流 (IIB) | 25 µA |
最大输入失调电压 | 50000 µV |
JESD-30 代码 | R-XDIP-T8 |
JESD-609代码 | e0 |
标称负供电电压 (Vsup) | -15 V |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP8,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | +-15 V |
认证状态 | Not Qualified |
筛选级别 | 38535Q/M;38534H;883B |
最小摆率 | 200 V/us |
最大压摆率 | 20 mA |
标称供电电压 (Vsup) | 15 V |
表面贴装 | NO |
技术 | BIPOLAR |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
EL2033J/883B | EL2003CH | EL2003CJ | EL2003H | EL2003H/883B | EL2003J | EL2003J/883B | EL2003L | EL2033CJ | EL2033J | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | Buffer Amplifier, 1 Func, BIPolar, CDIP8, | Buffer Amplifier, 1 Func, BIPolar, MBCY8, | Buffer Amplifier, 1 Func, BIPolar, CDIP8, | Buffer Amplifier, 1 Func, BIPolar, MBCY8, | Buffer Amplifier, 1 Func, BIPolar, MBCY8, | Buffer Amplifier, 1 Func, BIPolar, CDIP8, | Buffer Amplifier, 1 Func, BIPolar, CDIP8, | Buffer Amplifier, 1 Func, BIPolar, CQCC20, | Buffer Amplifier, 1 Func, BIPolar, CDIP8, | Buffer Amplifier, 1 Func, BIPolar, CDIP8, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
放大器类型 | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER |
标称带宽 (3dB) | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
25C 时的最大偏置电流 (IIB) | 25 µA | 25 µA | 25 µA | 25 µA | 25 µA | 25 µA | 25 µA | 25 µA | 25 µA | 25 µA |
最大输入失调电压 | 50000 µV | 50000 µV | 50000 µV | 50000 µV | 50000 µV | 50000 µV | 50000 µV | 50000 µV | 50000 µV | 50000 µV |
JESD-30 代码 | R-XDIP-T8 | O-MBCY-W8 | R-XDIP-T8 | O-MBCY-W8 | O-MBCY-W8 | R-XDIP-T8 | R-XDIP-T8 | S-XQCC-N20 | R-XDIP-T8 | R-XDIP-T8 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 20 | 8 | 8 |
最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 125 °C |
最低工作温度 | -55 °C | - | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | -55 °C |
封装主体材料 | CERAMIC | METAL | CERAMIC | METAL | METAL | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装等效代码 | DIP8,.3 | CAN8,.2 | DIP8,.3 | CAN8,.2 | CAN8,.2 | DIP8,.3 | DIP8,.3 | LCC20,.35SQ | DIP8,.3 | DIP8,.3 |
封装形状 | RECTANGULAR | ROUND | RECTANGULAR | ROUND | ROUND | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | CYLINDRICAL | IN-LINE | CYLINDRICAL | CYLINDRICAL | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE |
电源 | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最小摆率 | 200 V/us | 200 V/us | 200 V/us | 200 V/us | 200 V/us | 200 V/us | 200 V/us | 200 V/us | 200 V/us | 200 V/us |
最大压摆率 | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA |
标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | WIRE | THROUGH-HOLE | WIRE | WIRE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | DUAL | BOTTOM | DUAL | BOTTOM | BOTTOM | DUAL | DUAL | QUAD | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
封装代码 | DIP | - | DIP | - | - | DIP | DIP | QCCN | DIP | DIP |
表面贴装 | NO | - | NO | - | - | NO | NO | YES | NO | NO |
端子节距 | 2.54 mm | - | 2.54 mm | - | - | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
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