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M36W0R6030B0ZAQ: 产品描述64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package; 产品类别存储存储; 文件大小157KB，共26页; 制造商ST(意法半导体); 官网地址http://www.st.com/

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M36W0R6030B0ZAQ概述

64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package

M36W0R6030B0ZAQ规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	ST(意法半导体)
零件包装代码	BGA
包装说明	8 X 10 MM, 0.80 MM PITCH, TFBGA-88
针数	88
Reach Compliance Code	_compli
Is Samacsys	N
最长访问时间	70 ns
其他特性	SRAM IS ORGANIZED AS 512K X 16
JESD-30 代码	R-PBGA-B88
JESD-609代码	e0
长度	10 mm
内存密度	67108864 bi
内存集成电路类型	MEMORY CIRCUIT
内存宽度	16
混合内存类型	FLASH+SRAM
功能数量	1
端子数量	88
字数	4194304 words
字数代码	4000000
工作模式	ASYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	4MX16
封装主体材料	PLASTIC/EPOXY
封装代码	TFBGA
封装等效代码	BGA88,8X12,32
封装形状	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	1.8 V
认证状态	Not Qualified
座面最大高度	1.2 mm
最大待机电流	0.00001 A
最大压摆率	0.045 mA
最大供电电压 (Vsup)	1.95 V
最小供电电压 (Vsup)	1.7 V
标称供电电压 (Vsup)	1.8 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	BALL
端子节距	0.8 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	8 mm
Base Number Matches	1

M36W0R6030B0ZAQ相似产品对比

	M36W0R6030B0ZAQ	M36W0R6030B0	M36W0R6030B0ZAQT	M36W0R6030T0	M36W0R6030T0ZAQT	M36W0R6030T0ZAQF	M36W0R6030T0ZAQE	M36W0R6030T0ZAQ	M36W0R6030B0ZAQF	M36W0R6030B0ZAQE
描述	64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package	64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package	64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package	64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package	64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package	64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package	64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package	64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package	64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package	64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package
是否Rohs认证	不符合	-	不符合	-	不符合	符合	符合	不符合	符合	符合
厂商名称	ST(意法半导体)	-	ST(意法半导体)	-	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)
零件包装代码	BGA	-	BGA	-	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	8 X 10 MM, 0.80 MM PITCH, TFBGA-88	-	8 X 10 MM, 0.80 MM PITCH, TFBGA-88	-	8 X 10 MM, 0.80 MM PITCH, TFBGA-88	8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88	8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88	8 X 10 MM, 0.80 MM PITCH, TFBGA-88	8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88	8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88
针数	88	-	88	-	88	88	88	88	88	88
Reach Compliance Code	_compli	-	_compli	-	_compli	unknow	unknow	_compli	unknow	unknow
Is Samacsys	N	-	N	-	N	N	N	-	N	N
最长访问时间	70 ns	-	70 ns	-	70 ns	70 ns	70 ns	70 ns	70 ns	70 ns
其他特性	SRAM IS ORGANIZED AS 512K X 16	-	SRAM IS ORGANIZED AS 512K X 16	-	SRAM IS ORGANIZED AS 512K X 16	SRAM IS ORGANIZED AS 512K X 16	SRAM IS ORGANIZED AS 512K X 16	SRAM IS ORGANIZED AS 512K X 16	SRAM IS ORGANIZED AS 512K X 16	SRAM IS ORGANIZED AS 512K X 16
JESD-30 代码	R-PBGA-B88	-	R-PBGA-B88	-	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88
JESD-609代码	e0	-	e0	-	e0	e1	e1	e0	e1	e1
长度	10 mm	-	10 mm	-	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm
内存密度	67108864 bi	-	67108864 bi	-	67108864 bi	67108864 bi	67108864 bi	67108864 bi	67108864 bi	67108864 bi
内存集成电路类型	MEMORY CIRCUIT	-	MEMORY CIRCUIT	-	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
内存宽度	16	-	16	-	16	16	16	16	16	16
混合内存类型	FLASH+SRAM	-	FLASH+SRAM	-	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM
功能数量	1	-	1	-	1	1	1	1	1	1
端子数量	88	-	88	-	88	88	88	88	88	88
字数	4194304 words	-	4194304 words	-	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words
字数代码	4000000	-	4000000	-	4000000	4000000	4000000	4000000	4000000	4000000
工作模式	ASYNCHRONOUS	-	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	85 °C	-	85 °C	-	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	4MX16	-	4MX16	-	4MX16	4MX16	4MX16	4MX16	4MX16	4MX16
封装主体材料	PLASTIC/EPOXY	-	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TFBGA	-	TFBGA	-	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
封装等效代码	BGA88,8X12,32	-	BGA88,8X12,32	-	BGA88,8X12,32	BGA88,8X12,32	BGA88,8X12,32	BGA88,8X12,32	BGA88,8X12,32	BGA88,8X12,32
封装形状	RECTANGULAR	-	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH	-	GRID ARRAY, THIN PROFILE, FINE PITCH	-	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED	260	260	NOT SPECIFIED	260	260
电源	1.8 V	-	1.8 V	-	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
认证状态	Not Qualified	-	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.2 mm	-	1.2 mm	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
最大待机电流	0.00001 A	-	0.00001 A	-	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00001 A
最大压摆率	0.045 mA	-	0.045 mA	-	0.045 mA	0.045 mA	0.045 mA	0.045 mA	0.045 mA	0.045 mA
最大供电电压 (Vsup)	1.95 V	-	1.95 V	-	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V
最小供电电压 (Vsup)	1.7 V	-	1.7 V	-	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
标称供电电压 (Vsup)	1.8 V	-	1.8 V	-	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
表面贴装	YES	-	YES	-	YES	YES	YES	YES	YES	YES
技术	CMOS	-	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	-	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	TIN SILVER COPPER	TIN SILVER COPPER	Tin/Lead (Sn/Pb)	TIN SILVER COPPER	TIN SILVER COPPER
端子形式	BALL	-	BALL	-	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	0.8 mm	-	0.8 mm	-	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
端子位置	BOTTOM	-	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	8 mm	-	8 mm	-	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm
Base Number Matches	1	-	1	-	1	1	1	1	1	1

M36W0R6030B0ZAQ

M36W0R6030B0ZAQ概述

M36W0R6030B0ZAQ规格参数

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