OR Gate, HCT Series, 4-Func, 2-Input, CMOS, CDFP14
| 参数名称 | 属性值 |
| 包装说明 | , |
| Reach Compliance Code | unknown |
| 系列 | HCT |
| JESD-30 代码 | R-CDFP-F14 |
| JESD-609代码 | e4 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | OR GATE |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 传播延迟（tpd） | 20 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | GOLD |
| 端子形式 | FLAT |
| 端子位置 | DUAL |
| 总剂量 | 100k Rad(Si) V |
| Base Number Matches | 1 |
| 5962R9573601VXC | HCTS32KMSR | HCTS32DMSR | 5962R9573601VCC | 5962R9573601V9A | HCTS32D/SAMPLE | HCTS32HMSR | |
|---|---|---|---|---|---|---|---|
| 描述 | OR Gate, HCT Series, 4-Func, 2-Input, CMOS, CDFP14 | OR Gate, HCT Series, 4-Func, 2-Input, CMOS, CDFP14 | OR Gate, HCT Series, 4-Func, 2-Input, CMOS, CDIP14 | OR Gate, HCT Series, 4-Func, 2-Input, CMOS, CDIP14 | OR Gate, HCT Series, 4-Func, 2-Input, CMOS | OR Gate, HCT Series, 4-Func, 2-Input, CMOS, CDIP14 | OR Gate, HCT Series, 4-Func, 2-Input, CMOS |
| 包装说明 | , | DFP, FL14,.3 | DIP, DIP14,.3 | , | DIE, | , | DIE, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 系列 | HCT | HCT | HCT | HCT | HCT | HCT | HCT |
| JESD-30 代码 | R-CDFP-F14 | R-CDFP-F14 | R-CDIP-T14 | R-CDIP-T14 | X-XUUC-N14 | R-CDIP-T14 | X-XUUC-N14 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR | UNSPECIFIED |
| 封装形式 | FLATPACK | FLATPACK | IN-LINE | IN-LINE | UNCASED CHIP | IN-LINE | UNCASED CHIP |
| 传播延迟（tpd） | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | UPPER | DUAL | UPPER |
| JESD-609代码 | e4 | e0 | e0 | e4 | e0 | - | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | -55 °C |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - | MILITARY |
| 端子面层 | GOLD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | GOLD | TIN LEAD | - | - |
| 总剂量 | 100k Rad(Si) V | 200k Rad(Si) V | 200k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 厂商名称 | - | Harris | Harris | - | - | Harris | Harris |
| 封装代码 | - | DFP | DIP | - | DIE | - | DIE |
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