| 器件名 | 厂商 | 描 述 | 功能 |
|---|---|---|---|
| MAX19586 | Maxim(美信半导体) | High-Dynamic-Range, 16-Bit, 80Msps ADC with -82dBFS Noise Floor | 下载 |
| MAX19586ETN | Maxim(美信半导体) | Analog to Digital Converters - ADC | 下载 |
| MAX19586ETN+ | Maxim(美信半导体) | ADC, Proprietary Method, 16-Bit, 1 Func, 1 Channel, Parallel, Word Access, CMOS, 8 X 8 MM, 0.80 MM HEIGHT, LEAD FREE, EXPOSED PAD, MO-220WLLD-5, TQFN-56 | 下载 |
| MAX19586ETN-D | Maxim(美信半导体) | Analog to Digital Converters - ADC | 下载 |
| MAX19586ETN+D | Maxim(美信半导体) | Analog to Digital Converters - ADC High-Dynamic-Range, 16-Bit, 80Msps ADC with -82dBFS Noise Floor | 下载 |
| MAX19586ETN+D | Rochester Electronics | 1-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, QCC56, 8 X 8 MM, 0.80 MM HEIGHT, LEAD FREE, EXPOSED PAD, MO-220WLLD-5, TQFN-56 | 下载 |
| MAX19586ETN-T | Maxim(美信半导体) | Analog to Digital Converters - ADC High-Dynamic-Range 16-Bit 100Msps ADC with -82dBFS Noise Floor | 下载 |
| MAX19586ETN-TD | Maxim(美信半导体) | Analog to Digital Converters - ADC | 下载 |
| MAX19586ETN+TD | Maxim(美信半导体) | ADC, Proprietary Method, 16-Bit, 1 Func, 1 Channel, Parallel, Word Access, CMOS, 8 X 8 MM, 0.80 MM HEIGHT, LEAD FREE, EXPOSED PAD, MO-220WLLD-5, TQFN-56 | 下载 |
| MAX19586EVKIT | Maxim(美信半导体) | Data Conversion IC Development Tools Eval Kit MAX19586/MAX19588 (High-Dynamic-Range, 16-Bit, 80Msps ADC with -82dBFS Noise Floor) | 下载 |
| MAX19586EVKIT+ | Maxim(美信半导体) | Data Conversion IC Development Tools MAX19586/MAX19588 Evaluation Kits | 下载 |
| 对应元器件 | pdf文档资料下载 |
|---|---|
| MAX19586ETN 、 MAX19586ETN-D 、 MAX19586ETN-TD | 下载文档 |
| MAX19586ETN-T | 下载文档 |
| MAX19586EVKIT | 下载文档 |
| MAX19586EVKIT+ | 下载文档 |
| MAX19586ETN+TD | 下载文档 |
| MAX19586ETN+D | 下载文档 |
| MAX19586ETN+ | 下载文档 |
| MAX19586ETN+D | 下载文档 |
| MAX19586 | 下载文档 |
| 型号 | MAX19586ETN | MAX19586ETN-D | MAX19586ETN-TD |
|---|---|---|---|
| 描述 | Analog to Digital Converters - ADC | Analog to Digital Converters - ADC | Analog to Digital Converters - ADC |
| 是否无铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | QFN | QFN | QFN |
| 包装说明 | 8 X 8 MM, 0.80 MM HEIGHT, EXPOSED PAD, MO-220WLLD-5, TQFN-56 | 8 X 8 MM, 0.80 MM HEIGHT, MO-220WLLD-5, TQFN-56 | 8 X 8 MM, 0.80 MM HEIGHT, LEAD FREE, EXPOSED PAD, MO-220WLLD-5, TQFN-56 |
| 针数 | 56 | 56 | 56 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant |
| ECCN代码 | 3A001.A.5.A.5 | 3A001.A.5.A.5 | 3A001.A.5.A.5 |
| 最大模拟输入电压 | 2.56 V | 2.56 V | 2.56 V |
| 转换器类型 | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | S-XQCC-N56 | S-XQCC-N56 | S-XQCC-N56 |
| JESD-609代码 | e0 | e0 | e0 |
| 长度 | 8 mm | 8 mm | 8 mm |
| 模拟输入通道数量 | 1 | 1 | 1 |
| 位数 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 56 | 56 | 56 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C |
| 输出位码 | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | HVQCCN | HVQCCN | HVQCCN |
| 封装等效代码 | LCC56,.31SQ,20 | LCC56,.31SQ,20 | LCC56,.31SQ,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 245 | 245 | NOT SPECIFIED |
| 电源 | 1.8,3.3 V | 1.8,3.3 V | 1.8,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 80 MHz | 80 MHz | 80 MHz |
| 采样并保持/跟踪并保持 | TRACK | TRACK | TRACK |
| 座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 8 mm | 8 mm | 8 mm |
| 湿度敏感等级 | 3 | 3 | - |
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