Board Mount Temperature Sensors
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Microchip(微芯科技) |
| 包装说明 | , |
| Reach Compliance Code | compliant |
| Factory Lead Time | 7 weeks |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-609代码 | e4 |
| 湿度敏感等级 | 3 |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 处于峰值回流温度下的最长时间 | 40 |
| MIC284-1YM-TR | MIC284-2YM-TR | MIC284-2YMM-TR | MIC284-1YMM-TR | MIC284-2YM | MIC284-2YMM | |
|---|---|---|---|---|---|---|
| 描述 | Board Mount Temperature Sensors | Board Mount Temperature Sensors | Board Mount Temperature Sensors | Board Mount Temperature Sensors 2-Zone Thermal Supervisor w/Over-Temp Output | ||
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
| 包装说明 | , | SOP, | TSSOP, | LEAD FREE, MSOP-8 | SOP, | TSSOP, |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| Factory Lead Time | 7 weeks | 7 weeks | 5 weeks | 5 weeks | 7 weeks | 5 weeks |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 |
| 湿度敏感等级 | 3 | 3 | 1 | 1 | 3 | 1 |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | 40 |
| JESD-30 代码 | - | R-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 |
| 长度 | - | 4.93 mm | 3 mm | 3 mm | 4.93 mm | 3 mm |
| 功能数量 | - | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | - | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | SOP | TSSOP | TSSOP | SOP | TSSOP |
| 封装形状 | - | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | - | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 座面最大高度 | - | 1.73 mm | 1.1 mm | 1.1 mm | 1.73 mm | 1.1 mm |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | - | YES | YES | YES | YES | YES |
| 温度等级 | - | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | - | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | - | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | - | 3.94 mm | 3 mm | 3 mm | 3.94 mm | 3 mm |
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