Analog Switch ICs Quad SPST Switch
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 厂商名称 | Vishay(威世) |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP, TSSOP16,.25 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 其他特性 | ALSO OPERATES WITH 2.7 V TO 12 V SINGLE SUPPLY |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 长度 | 5 mm |
| 负电源电压最大值（Vsup） | -6 V |
| 负电源电压最小值（Vsup） | -3 V |
| 标称负供电电压 (Vsup) | -5 V |
| 正常位置 | NO/NC |
| 信道数量 | 1 |
| 功能数量 | 4 |
| 端子数量 | 16 |
| 标称断态隔离度 | 68 dB |
| 最大通态电阻 (Ron) | 33 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出 | SEPARATE OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 3/12/+-5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 最长断开时间 | 40 ns |
| 最长接通时间 | 60 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 4.4 mm |
| DG413LDQ-T1 | DG411LDY-E3 | DG413LDJ | DG412LDY | DG412LDY-T1 | DG413LAK | |
|---|---|---|---|---|---|---|
| 描述 | Analog Switch ICs Quad SPST Switch | Multilayer Ceramic Capacitors MLCC - SMD/SMT 4.7uF 6.3V +/-20% 0402 X5R GenPurp | Analog Switch ICs Quad SPST Switch | Analog Switch ICs Lo-V Quad Mono SPST | Analog Switch ICs Low Voltage Quad SPST CMOS Swtch | |
| 是否无铅 | 含铅 | 不含铅 | - | 含铅 | 含铅 | 含铅 |
| 厂商名称 | Vishay(威世) | Vishay(威世) | - | Vishay(威世) | Vishay(威世) | Vishay(威世) |
| 零件包装代码 | TSSOP | SOIC | - | SOIC | SOIC | DIP |
| 包装说明 | TSSOP, TSSOP16,.25 | SOP, SOP16,.25 | - | SOP, SOP16,.25 | SOP, SOP16,.25 | DIP, DIP16,.3 |
| 针数 | 16 | 16 | - | 16 | 16 | 16 |
| Reach Compliance Code | unknown | unknown | - | unknown | unknown | unknown |
| 其他特性 | ALSO OPERATES WITH 2.7 V TO 12 V SINGLE SUPPLY | ALSO OPERATES WITH 2.7 V TO 12 V SINGLE SUPPLY | - | - | ALSO OPERATES WITH 2.7 V TO 12 V SINGLE SUPPLY | ALSO OPERATES WITH 2.7 V TO 12 V SINGLE SUPPLY |
| 模拟集成电路 - 其他类型 | SPST | SPST | - | SPST | SPST | SPST |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | - | R-PDSO-G16 | R-PDSO-G16 | R-GDIP-T16 |
| JESD-609代码 | e0 | e3 | - | e0 | e0 | - |
| 长度 | 5 mm | 9.9 mm | - | - | 9.9 mm | 19.305 mm |
| 负电源电压最大值（Vsup） | -6 V | -6 V | - | - | -6 V | -6 V |
| 负电源电压最小值（Vsup） | -3 V | -3 V | - | - | -3 V | -3 V |
| 标称负供电电压 (Vsup) | -5 V | -5 V | - | - | -5 V | -5 V |
| 正常位置 | NO/NC | NC | - | NO | NO | NO/NC |
| 信道数量 | 1 | 1 | - | - | 1 | 1 |
| 功能数量 | 4 | 4 | - | 4 | 4 | 4 |
| 端子数量 | 16 | 16 | - | 16 | 16 | 16 |
| 标称断态隔离度 | 68 dB | 68 dB | - | - | 68 dB | 68 dB |
| 最大通态电阻 (Ron) | 33 Ω | 33 Ω | - | 100 Ω | 33 Ω | 33 Ω |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C | 85 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -55 °C |
| 输出 | SEPARATE OUTPUT | SEPARATE OUTPUT | - | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | TSSOP | SOP | - | SOP | SOP | DIP |
| 封装等效代码 | TSSOP16,.25 | SOP16,.25 | - | SOP16,.25 | SOP16,.25 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | - | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 峰值回流温度（摄氏度） | 240 | 260 | - | - | 240 | NOT SPECIFIED |
| 电源 | 3/12/+-5 V | 3/12/+-5 V | - | 3/12/+-5 V | 3/12/+-5 V | 3/12/+-5 V |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.75 mm | - | - | 1.75 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | - | - | 6 V | 6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | - | - | 3 V | 3 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | - | 5 V | 5 V |
| 表面贴装 | YES | YES | - | YES | YES | NO |
| 最长断开时间 | 40 ns | 40 ns | - | - | 40 ns | 35 ns |
| 最长接通时间 | 60 ns | 60 ns | - | 85 ns | 60 ns | 50 ns |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | BICMOS | BICMOS | - | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | MILITARY |
| 端子面层 | TIN LEAD | MATTE TIN | - | Tin/Lead (Sn/Pb) | TIN LEAD | - |
| 端子形式 | GULL WING | GULL WING | - | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 0.65 mm | 1.27 mm | - | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 40 | - | - | 30 | NOT SPECIFIED |
| 宽度 | 4.4 mm | 3.9 mm | - | - | 3.9 mm | 7.62 mm |
单片机
聊聊、笑笑、闹闹
嵌入式系统
51单片机
TI技术论坛
微控制器 MCU
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
