|
DG412LDY |
DG411LDY-E3 |
DG413LDJ |
DG413LDQ-T1 |
DG412LDY-T1 |
DG413LAK |
描述 |
|
Multilayer Ceramic Capacitors MLCC - SMD/SMT 4.7uF 6.3V +/-20% 0402 X5R GenPurp |
Analog Switch ICs Quad SPST Switch |
Analog Switch ICs Quad SPST Switch |
Analog Switch ICs Lo-V Quad Mono SPST |
Analog Switch ICs Low Voltage Quad SPST CMOS Swtch |
是否无铅 |
含铅 |
不含铅 |
- |
含铅 |
含铅 |
含铅 |
厂商名称 |
Vishay(威世) |
Vishay(威世) |
- |
Vishay(威世) |
Vishay(威世) |
Vishay(威世) |
零件包装代码 |
SOIC |
SOIC |
- |
TSSOP |
SOIC |
DIP |
包装说明 |
SOP, SOP16,.25 |
SOP, SOP16,.25 |
- |
TSSOP, TSSOP16,.25 |
SOP, SOP16,.25 |
DIP, DIP16,.3 |
针数 |
16 |
16 |
- |
16 |
16 |
16 |
Reach Compliance Code |
unknown |
unknown |
- |
unknown |
unknown |
unknown |
模拟集成电路 - 其他类型 |
SPST |
SPST |
- |
SPST |
SPST |
SPST |
JESD-30 代码 |
R-PDSO-G16 |
R-PDSO-G16 |
- |
R-PDSO-G16 |
R-PDSO-G16 |
R-GDIP-T16 |
JESD-609代码 |
e0 |
e3 |
- |
e0 |
e0 |
- |
正常位置 |
NO |
NC |
- |
NO/NC |
NO |
NO/NC |
功能数量 |
4 |
4 |
- |
4 |
4 |
4 |
端子数量 |
16 |
16 |
- |
16 |
16 |
16 |
最大通态电阻 (Ron) |
100 Ω |
33 Ω |
- |
33 Ω |
33 Ω |
33 Ω |
最高工作温度 |
85 °C |
85 °C |
- |
85 °C |
85 °C |
125 °C |
最低工作温度 |
-40 °C |
-40 °C |
- |
-40 °C |
-40 °C |
-55 °C |
输出 |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
- |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
CERAMIC, GLASS-SEALED |
封装代码 |
SOP |
SOP |
- |
TSSOP |
SOP |
DIP |
封装等效代码 |
SOP16,.25 |
SOP16,.25 |
- |
TSSOP16,.25 |
SOP16,.25 |
DIP16,.3 |
封装形状 |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
封装形式 |
SMALL OUTLINE |
SMALL OUTLINE |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
IN-LINE |
电源 |
3/12/+-5 V |
3/12/+-5 V |
- |
3/12/+-5 V |
3/12/+-5 V |
3/12/+-5 V |
认证状态 |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
表面贴装 |
YES |
YES |
- |
YES |
YES |
NO |
最长接通时间 |
85 ns |
60 ns |
- |
60 ns |
60 ns |
50 ns |
切换 |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
- |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
技术 |
BICMOS |
BICMOS |
- |
BICMOS |
BICMOS |
BICMOS |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
- |
INDUSTRIAL |
INDUSTRIAL |
MILITARY |
端子面层 |
Tin/Lead (Sn/Pb) |
MATTE TIN |
- |
TIN LEAD |
TIN LEAD |
- |
端子形式 |
GULL WING |
GULL WING |
- |
GULL WING |
GULL WING |
THROUGH-HOLE |
端子节距 |
1.27 mm |
1.27 mm |
- |
0.65 mm |
1.27 mm |
2.54 mm |
端子位置 |
DUAL |
DUAL |
- |
DUAL |
DUAL |
DUAL |
其他特性 |
- |
ALSO OPERATES WITH 2.7 V TO 12 V SINGLE SUPPLY |
- |
ALSO OPERATES WITH 2.7 V TO 12 V SINGLE SUPPLY |
ALSO OPERATES WITH 2.7 V TO 12 V SINGLE SUPPLY |
ALSO OPERATES WITH 2.7 V TO 12 V SINGLE SUPPLY |
长度 |
- |
9.9 mm |
- |
5 mm |
9.9 mm |
19.305 mm |
负电源电压最大值(Vsup) |
- |
-6 V |
- |
-6 V |
-6 V |
-6 V |
负电源电压最小值(Vsup) |
- |
-3 V |
- |
-3 V |
-3 V |
-3 V |
标称负供电电压 (Vsup) |
- |
-5 V |
- |
-5 V |
-5 V |
-5 V |
信道数量 |
- |
1 |
- |
1 |
1 |
1 |
标称断态隔离度 |
- |
68 dB |
- |
68 dB |
68 dB |
68 dB |
峰值回流温度(摄氏度) |
- |
260 |
- |
240 |
240 |
NOT SPECIFIED |
座面最大高度 |
- |
1.75 mm |
- |
1.2 mm |
1.75 mm |
5.08 mm |
最大供电电压 (Vsup) |
- |
6 V |
- |
6 V |
6 V |
6 V |
最小供电电压 (Vsup) |
- |
3 V |
- |
3 V |
3 V |
3 V |
标称供电电压 (Vsup) |
- |
5 V |
- |
5 V |
5 V |
5 V |
最长断开时间 |
- |
40 ns |
- |
40 ns |
40 ns |
35 ns |
处于峰值回流温度下的最长时间 |
- |
40 |
- |
30 |
30 |
NOT SPECIFIED |
宽度 |
- |
3.9 mm |
- |
4.4 mm |
3.9 mm |
7.62 mm |