Synchronous DRAM, 4MX4, 8ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | TSOP2 |
包装说明 | TSOP2, TSOP44,.46,32 |
针数 | 44 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
访问模式 | DUAL BANK PAGE BURST |
最长访问时间 | 8 ns |
其他特性 | AUTO/SELF REFRESH |
最大时钟频率 (fCLK) | 100 MHz |
I/O 类型 | COMMON |
交错的突发长度 | 1,2,4,8 |
JESD-30 代码 | R-PDSO-G44 |
JESD-609代码 | e0 |
长度 | 18.41 mm |
内存密度 | 16777216 bit |
内存集成电路类型 | SYNCHRONOUS DRAM |
内存宽度 | 4 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 44 |
字数 | 4194304 words |
字数代码 | 4000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 4MX4 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP2 |
封装等效代码 | TSOP44,.46,32 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 3.3 V |
认证状态 | Not Qualified |
刷新周期 | 4096 |
座面最大高度 | 1.2 mm |
自我刷新 | YES |
连续突发长度 | 1,2,4,8,FP |
最大待机电流 | 0.002 A |
最大压摆率 | 0.175 mA |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 10.16 mm |
Base Number Matches | 1 |
IBM0316409CT3D-10 | IBM0316409CT3D-80 | IBM0316809CT3D-80 | IBM03164B9CT3D-10 | IBM0316809CT3D-10 | IBM0316169CT3D-80 | IBM0316169CT3D-10 | IBM0316809CT3D-360 | |
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描述 | Synchronous DRAM, 4MX4, 8ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44 | Synchronous DRAM, 4MX4, 6ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44 | Synchronous DRAM, 2MX8, 6ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44 | Synchronous DRAM Module, 4MX4, 8ns, CMOS, PDSO44, 0.400 INCH, 2 HIGH STACK, PLASTIC, TSOJ2-44 | Synchronous DRAM, 2MX8, 8ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44 | Synchronous DRAM, 1MX16, 6ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 | Synchronous DRAM, 1MX16, 8ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 | Synchronous DRAM, 2MX8, 5.5ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | TSOP2 | TSOP2 | TSOP2 | SOJ | TSOP2 | TSOP2 | TSOP2 | TSOP2 |
包装说明 | TSOP2, TSOP44,.46,32 | TSOP2, TSOP44,.46,32 | TSOP2, TSOP44,.46,32 | SOJ, SOJ44,.44,32 | TSOP2, TSOP44,.46,32 | TSOP2, TSOP50,.46,32 | TSOP2, TSOP50,.46,32 | TSOP2, TSOP44,.46,32 |
针数 | 44 | 44 | 44 | 44 | 44 | 50 | 50 | 44 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST |
最长访问时间 | 8 ns | 6 ns | 6 ns | 8 ns | 8 ns | 6 ns | 8 ns | 5.5 ns |
其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
最大时钟频率 (fCLK) | 100 MHz | 125 MHz | 125 MHz | 100 MHz | 100 MHz | 125 MHz | 100 MHz | 100 MHz |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-J44 | R-PDSO-G44 | R-PDSO-G50 | R-PDSO-G50 | R-PDSO-G44 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 18.41 mm | 18.41 mm | 18.41 mm | 18.4 mm | 18.41 mm | 20.95 mm | 20.95 mm | 18.41 mm |
内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
内存集成电路类型 | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM |
内存宽度 | 4 | 4 | 8 | 4 | 8 | 16 | 16 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 44 | 44 | 44 | 44 | 44 | 50 | 50 | 44 |
字数 | 4194304 words | 4194304 words | 2097152 words | 4194304 words | 2097152 words | 1048576 words | 1048576 words | 2097152 words |
字数代码 | 4000000 | 4000000 | 2000000 | 4000000 | 2000000 | 1000000 | 1000000 | 2000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 4MX4 | 4MX4 | 2MX8 | 4MX4 | 2MX8 | 1MX16 | 1MX16 | 2MX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP2 | TSOP2 | TSOP2 | SOJ | TSOP2 | TSOP2 | TSOP2 | TSOP2 |
封装等效代码 | TSOP44,.46,32 | TSOP44,.46,32 | TSOP44,.46,32 | SOJ44,.44,32 | TSOP44,.46,32 | TSOP50,.46,32 | TSOP50,.46,32 | TSOP44,.46,32 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 3.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
自我刷新 | YES | YES | YES | YES | YES | YES | YES | YES |
最大待机电流 | 0.002 A | 0.002 A | 0.002 A | 0.004 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A |
最大压摆率 | 0.175 mA | 0.22 mA | 0.22 mA | 0.175 mA | 0.175 mA | 0.24 mA | 0.19 mA | 0.175 mA |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | J BEND | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.15 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
交错的突发长度 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | - | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 |
连续突发长度 | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | - | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP |
厂商名称 | - | IBM | IBM | IBM | IBM | IBM | IBM | IBM |
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