1V, Low-Power, DirectDrive, Stereo Headphone Amplifier with Shutdown
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | BGA |
包装说明 | 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 |
针数 | 12 |
Reach Compliance Code | _compli |
ECCN代码 | EAR99 |
标称带宽 | 22 kHz |
商用集成电路类型 | AUDIO AMPLIFIER |
JESD-30 代码 | R-PBGA-B12 |
JESD-609代码 | e0 |
长度 | 2.02 mm |
湿度敏感等级 | 1 |
信道数量 | 2 |
功能数量 | 1 |
端子数量 | 12 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
标称输出功率 | 0.025 W |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | VFBGA |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 245 |
认证状态 | Not Qualified |
座面最大高度 | 0.67 mm |
最大供电电压 (Vsup) | 1.8 V |
最小供电电压 (Vsup) | 0.9 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | BALL |
端子节距 | 0.5 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 1.54 mm |
MAX9725AEBC | MAX9725 | MAX9725BEBC | MAX9725CEBC | MAX9725DEBC | MAX9725DEC | |
---|---|---|---|---|---|---|
描述 | 1V, Low-Power, DirectDrive, Stereo Headphone Amplifier with Shutdown | 1V, Low-Power, DirectDrive, Stereo Headphone Amplifier with Shutdown | 1V, Low-Power, DirectDrive, Stereo Headphone Amplifier with Shutdown | 1V, Low-Power, DirectDrive, Stereo Headphone Amplifier with Shutdown | 1V, Low-Power, DirectDrive, Stereo Headphone Amplifier with Shutdown | 1V, Low-Power, DirectDrive, Stereo Headphone Amplifier with Shutdown |
是否无铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | - |
是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | - |
零件包装代码 | BGA | - | BGA | BGA | BGA | - |
包装说明 | 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 | - | 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 | 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 | 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 | - |
针数 | 12 | - | 12 | 12 | 12 | - |
Reach Compliance Code | _compli | - | _compli | _compli | _compli | - |
ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | - |
标称带宽 | 22 kHz | - | 22 kHz | 22 kHz | 22 kHz | - |
商用集成电路类型 | AUDIO AMPLIFIER | - | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | - |
JESD-30 代码 | R-PBGA-B12 | - | R-PBGA-B12 | R-PBGA-B12 | R-PBGA-B12 | - |
JESD-609代码 | e0 | - | e0 | e0 | e0 | - |
长度 | 2.02 mm | - | 2.02 mm | 2.02 mm | 2.02 mm | - |
湿度敏感等级 | 1 | - | 1 | 1 | 1 | - |
信道数量 | 2 | - | 2 | 2 | 2 | - |
功能数量 | 1 | - | 1 | 1 | 1 | - |
端子数量 | 12 | - | 12 | 12 | 12 | - |
最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | - |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | - |
标称输出功率 | 0.025 W | - | 0.025 W | 0.025 W | 0.025 W | - |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | VFBGA | - | VFBGA | VFBGA | VFBGA | - |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - |
峰值回流温度(摄氏度) | 245 | - | 245 | 245 | 245 | - |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - |
座面最大高度 | 0.67 mm | - | 0.67 mm | 0.67 mm | 0.67 mm | - |
最大供电电压 (Vsup) | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V | - |
最小供电电压 (Vsup) | 0.9 V | - | 0.9 V | 0.9 V | 0.9 V | - |
表面贴装 | YES | - | YES | YES | YES | - |
技术 | BICMOS | - | BICMOS | BICMOS | BICMOS | - |
温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
端子形式 | BALL | - | BALL | BALL | BALL | - |
端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | - |
端子位置 | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
宽度 | 1.54 mm | - | 1.54 mm | 1.54 mm | 1.54 mm | - |
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