1V, Low-Power, DirectDrive, Stereo Headphone Amplifier with Shutdown
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | BGA |
| 包装说明 | 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 |
| 针数 | 12 |
| Reach Compliance Code | _compli |
| ECCN代码 | EAR99 |
| 标称带宽 | 22 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER |
| JESD-30 代码 | R-PBGA-B12 |
| JESD-609代码 | e0 |
| 长度 | 2.02 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 2 |
| 功能数量 | 1 |
| 端子数量 | 12 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 标称输出功率 | 0.025 W |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 245 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.67 mm |
| 最大供电电压 (Vsup) | 1.8 V |
| 最小供电电压 (Vsup) | 0.9 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 1.54 mm |
| Base Number Matches | 1 |
| MAX9725CEBC | MAX9725 | MAX9725AEBC | MAX9725BEBC | MAX9725DEBC | MAX9725DEC | |
|---|---|---|---|---|---|---|
| 描述 | 1V, Low-Power, DirectDrive, Stereo Headphone Amplifier with Shutdown | 1V, Low-Power, DirectDrive, Stereo Headphone Amplifier with Shutdown | 1V, Low-Power, DirectDrive, Stereo Headphone Amplifier with Shutdown | 1V, Low-Power, DirectDrive, Stereo Headphone Amplifier with Shutdown | 1V, Low-Power, DirectDrive, Stereo Headphone Amplifier with Shutdown | 1V, Low-Power, DirectDrive, Stereo Headphone Amplifier with Shutdown |
| 是否无铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | - |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | - |
| 零件包装代码 | BGA | - | BGA | BGA | BGA | - |
| 包装说明 | 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 | - | 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 | 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 | 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 | - |
| 针数 | 12 | - | 12 | 12 | 12 | - |
| Reach Compliance Code | _compli | - | _compli | _compli | _compli | - |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | - |
| 标称带宽 | 22 kHz | - | 22 kHz | 22 kHz | 22 kHz | - |
| 商用集成电路类型 | AUDIO AMPLIFIER | - | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | - |
| JESD-30 代码 | R-PBGA-B12 | - | R-PBGA-B12 | R-PBGA-B12 | R-PBGA-B12 | - |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | - |
| 长度 | 2.02 mm | - | 2.02 mm | 2.02 mm | 2.02 mm | - |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 | - |
| 信道数量 | 2 | - | 2 | 2 | 2 | - |
| 功能数量 | 1 | - | 1 | 1 | 1 | - |
| 端子数量 | 12 | - | 12 | 12 | 12 | - |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | - |
| 标称输出功率 | 0.025 W | - | 0.025 W | 0.025 W | 0.025 W | - |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | VFBGA | - | VFBGA | VFBGA | VFBGA | - |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - |
| 峰值回流温度（摄氏度） | 245 | - | 245 | 245 | 245 | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 0.67 mm | - | 0.67 mm | 0.67 mm | 0.67 mm | - |
| 最大供电电压 (Vsup) | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V | - |
| 最小供电电压 (Vsup) | 0.9 V | - | 0.9 V | 0.9 V | 0.9 V | - |
| 表面贴装 | YES | - | YES | YES | YES | - |
| 技术 | BICMOS | - | BICMOS | BICMOS | BICMOS | - |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | BALL | - | BALL | BALL | BALL | - |
| 端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | - |
| 端子位置 | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | 1.54 mm | - | 1.54 mm | 1.54 mm | 1.54 mm | - |
TI技术论坛
实时操作系统RTOS
RF/无线
Altera SoC
RF/无线
DSP 与 ARM 处理器
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
