Math Coprocessor, CMOS, CPGA68, CERAMIC, PGA-68
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | PGA |
| 包装说明 | PGA, PGA68,10X10 |
| 针数 | 68 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| JESD-30 代码 | S-CPGA-P68 |
| JESD-609代码 | e4 |
| 长度 | 26.92 mm |
| 端子数量 | 68 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | PGA |
| 封装等效代码 | PGA68,10X10 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 4.82 mm |
| 最大压摆率 | 150 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Gold (Au) |
| 端子形式 | PIN/PEG |
| 端子节距 | 2.54 mm |
| 端子位置 | PERPENDICULAR |
| 宽度 | 26.92 mm |
| uPs/uCs/外围集成电路类型 | MATH PROCESSOR, COPROCESSOR |
| Base Number Matches | 1 |
这份文档是关于TS68882增强型浮点协处理器的数据手册,它包含了大量的技术信息,对于硬件工程师、系统设计师或嵌入式系统开发者来说,以下是一些值得关注的技术信息:
协处理器特性:
指令集:
数据类型:
硬件设计:
兼容性和应用:
性能参数:
质量与可靠性:
封装信息:
电气特性:
热特性:
机械和环境要求:
标记信息:
质量一致性检验:
测试条件:
功能描述:
操作模式:
引脚分配和信号描述:
订购信息:

| 5962-8946304XC | 5962-8946303YC | 5962-8946302XC | 5962-8946302YC | 5962-8946302YA | 5962-8946301YC | 5962-8946302XA | 5962-8946301XC | 5962-8946303XC | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Math Coprocessor, CMOS, CPGA68, CERAMIC, PGA-68 | Math Coprocessor, CMOS, CQFP68, CERAMIC, QFP-68 | Math Coprocessor, CMOS, CPGA68, CERAMIC, PGA-68 | Math Coprocessor, CMOS, CQFP68, CERAMIC, QFP-68 | Math Coprocessor, CMOS, CQFP68, CERAMIC, QFP-68 | Math Coprocessor, CMOS, CQFP68, CERAMIC, QFP-68 | Math Coprocessor, CMOS, CPGA68, CERAMIC, PGA-68 | Math Coprocessor, 32-Bit, CMOS, CPGA68, CERAMIC, PGA-68 | Math Coprocessor, CMOS, CPGA68, CERAMIC, PGA-68 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | PGA | QFP | PGA | QFP | QFP | QFP | PGA | PGA | PGA |
| 包装说明 | PGA, PGA68,10X10 | QFP, QFP68,1.1SQ,50 | PGA, PGA68,10X10 | QFP, QFP68,1.1SQ,50 | QFP, QFP68,1.1SQ,50 | QFP, QFP68,1.1SQ,50 | PGA, PGA68,10X10 | PGA, PGA68,10X10 | PGA, PGA68,10X10 |
| 针数 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | compliant | unknown | compliant | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| JESD-30 代码 | S-CPGA-P68 | S-CQFP-G68 | S-CPGA-P68 | S-CQFP-G68 | S-CQFP-G68 | S-CQFP-G68 | S-CPGA-P68 | S-CPGA-P68 | S-CPGA-P68 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e0 | e4 | e0 | e4 | e4 |
| 长度 | 26.92 mm | 24.13 mm | 26.92 mm | 24.13 mm | 24.13 mm | 24.13 mm | 26.92 mm | 26.92 mm | 26.92 mm |
| 端子数量 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | PGA | QFP | PGA | QFP | QFP | QFP | PGA | PGA | PGA |
| 封装等效代码 | PGA68,10X10 | QFP68,1.1SQ,50 | PGA68,10X10 | QFP68,1.1SQ,50 | QFP68,1.1SQ,50 | QFP68,1.1SQ,50 | PGA68,10X10 | PGA68,10X10 | PGA68,10X10 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | FLATPACK | GRID ARRAY | FLATPACK | FLATPACK | FLATPACK | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 座面最大高度 | 4.82 mm | 3.43 mm | 4.82 mm | 3.43 mm | 3.43 mm | 3.43 mm | 4.184 mm | 4.82 mm | 4.82 mm |
| 最大压摆率 | 150 mA | 150 mA | 150 mA | 150 mA | 150 mA | 150 mA | 150 mA | 150 mA | 150 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | YES | YES | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Gold (Au) | Gold (Au) | Gold (Au) | Gold (Au) | Tin/Lead (Sn/Pb) - hot dipped | Gold (Au) | Tin/Lead (Sn/Pb) - hot dipped | Gold (Au) | Gold (Au) |
| 端子形式 | PIN/PEG | GULL WING | PIN/PEG | GULL WING | GULL WING | GULL WING | PIN/PEG | PIN/PEG | PIN/PEG |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | PERPENDICULAR | QUAD | PERPENDICULAR | QUAD | QUAD | QUAD | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
| 宽度 | 26.92 mm | 24.13 mm | 26.92 mm | 24.13 mm | 24.13 mm | 24.13 mm | 26.92 mm | 26.92 mm | 26.92 mm |
| uPs/uCs/外围集成电路类型 | MATH PROCESSOR, COPROCESSOR | MATH PROCESSOR, COPROCESSOR | MATH PROCESSOR, COPROCESSOR | MATH PROCESSOR, COPROCESSOR | MATH PROCESSOR, COPROCESSOR | MATH PROCESSOR, COPROCESSOR | MATH PROCESSOR, COPROCESSOR | MATH PROCESSOR, COPROCESSOR | MATH PROCESSOR, COPROCESSOR |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved