Register StackÃ16 x 4 RAM TRI-STATEE Output Register
| 74F410 | 54F410 | 54F410DM | 54F410LM | 74F410PC | 74F410SC | |
|---|---|---|---|---|---|---|
| 描述 | Register StackÃ16 x 4 RAM TRI-STATEE Output Register | Register StackÃ16 x 4 RAM TRI-STATEE Output Register | Register StackÃ16 x 4 RAM TRI-STATEE Output Register | Register StackÃ16 x 4 RAM TRI-STATEE Output Register | Register StackÃ16 x 4 RAM TRI-STATEE Output Register | Register StackÃ16 x 4 RAM TRI-STATEE Output Register |
| 是否Rohs认证 | - | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | - | - | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| 包装说明 | - | - | DIP, DIP18,.3 | CERPACK-20 | DIP, DIP18,.3 | SOP, SO20(UNSPEC) |
| Reach Compliance Code | - | - | unknow | unknow | unknow | unknow |
| ECCN代码 | - | - | 3A001.A.2.C | 3A001.A.2.C | EAR99 | EAR99 |
| 最长访问时间 | - | - | 12 ns | 12 ns | 10 ns | 10 ns |
| JESD-30 代码 | - | - | R-GDIP-T18 | R-GDFP-F20 | R-PDIP-T18 | R-PDSO-G20 |
| JESD-609代码 | - | - | e0 | e0 | e0 | e0 |
| 内存密度 | - | - | 64 bi | 64 bi | 64 bi | 64 bi |
| 内存集成电路类型 | - | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | - | - | 4 | 4 | 4 | 4 |
| 功能数量 | - | - | 1 | 1 | 1 | 1 |
| 端子数量 | - | - | 18 | 20 | 18 | 20 |
| 字数 | - | - | 16 words | 16 words | 16 words | 16 words |
| 字数代码 | - | - | 16 | 16 | 16 | 16 |
| 工作模式 | - | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | - | - | 125 °C | 125 °C | 70 °C | 70 °C |
| 组织 | - | - | 16X4 | 16X4 | 16X4 | 16X4 |
| 封装主体材料 | - | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | - | DIP | DFP | DIP | SOP |
| 封装等效代码 | - | - | DIP18,.3 | LCC20,.35SQ | DIP18,.3 | SO20(UNSPEC) |
| 封装形状 | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | - | IN-LINE | FLATPACK | IN-LINE | SMALL OUTLINE |
| 并行/串行 | - | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | - | - | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | - | 5.08 mm | 2.286 mm | 5.08 mm | 2.65 mm |
| 最大供电电压 (Vsup) | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | - | - | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | - | - | NO | YES | NO | YES |
| 技术 | - | - | TTL | TTL | TTL | CMOS |
| 温度等级 | - | - | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
| 端子面层 | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | - | THROUGH-HOLE | FLAT | THROUGH-HOLE | GULL WING |
| 端子节距 | - | - | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | - | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | - | 7.62 mm | 6.731 mm | 7.62 mm | 7.5 mm |
| Base Number Matches | - | - | 1 | 1 | 1 | 1 |
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