PROGRAMMABLE ARRAY LOGIC(PAL)
| PAL20RA10VM | PAL20RA10 | PAL20RA10JC | PAL20RA10JM | PAL20RA10NC | PAL20RA10NM | PAL20RA10VC | |
|---|---|---|---|---|---|---|---|
| 描述 | PROGRAMMABLE ARRAY LOGIC(PAL) | PROGRAMMABLE ARRAY LOGIC(PAL) | PROGRAMMABLE ARRAY LOGIC(PAL) | PROGRAMMABLE ARRAY LOGIC(PAL) | PROGRAMMABLE ARRAY LOGIC(PAL) | PROGRAMMABLE ARRAY LOGIC(PAL) | PROGRAMMABLE ARRAY LOGIC(PAL) |
| 是否Rohs认证 | - | - | 不符合 | 不符合 | 不符合 | - | 不符合 |
| 厂商名称 | - | - | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | - | National Semiconductor（TI ） |
| 包装说明 | - | - | DIP, DIP24,.3 | DIP, DIP24,.3 | 0.300 INCH, SKINNY, PLASTIC, DIP-24 | - | QCCJ, LDCC28,.5SQ |
| Reach Compliance Code | - | - | unknown | unknown | unknown | - | unknow |
| 其他特性 | - | - | POWER-UP RESET; REGISTER PRELOAD | POWER-UP RESET; REGISTER PRELOAD | POWER-UP RESET; REGISTER PRELOAD | - | POWER-UP RESET; REGISTER PRELOAD |
| 架构 | - | - | PAL-TYPE | PAL-TYPE | PAL-TYPE | - | PAL-TYPE |
| 最大时钟频率 | - | - | 20 MHz | 16.6 MHz | 20 MHz | - | 20 MHz |
| JESD-30 代码 | - | - | R-GDIP-T24 | R-GDIP-T24 | R-PDIP-T24 | - | S-PQCC-J28 |
| JESD-609代码 | - | - | e0 | e0 | e0 | - | e0 |
| 专用输入次数 | - | - | 10 | 10 | 10 | - | 10 |
| I/O 线路数量 | - | - | 10 | 10 | 10 | - | 10 |
| 输入次数 | - | - | 20 | 20 | 20 | - | 20 |
| 输出次数 | - | - | 10 | 10 | 10 | - | 10 |
| 产品条款数 | - | - | 80 | 80 | 80 | - | 80 |
| 端子数量 | - | - | 24 | 24 | 24 | - | 28 |
| 最高工作温度 | - | - | 75 °C | 125 °C | 75 °C | - | 75 °C |
| 组织 | - | - | 10 DEDICATED INPUTS, 10 I/O | 10 DEDICATED INPUTS, 10 I/O | 10 DEDICATED INPUTS, 10 I/O | - | 10 DEDICATED INPUTS, 10 I/O |
| 输出函数 | - | - | MACROCELL | MACROCELL | MACROCELL | - | MACROCELL |
| 封装主体材料 | - | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | - | - | DIP | DIP | DIP | - | QCCJ |
| 封装等效代码 | - | - | DIP24,.3 | DIP24,.3 | DIP24,.3 | - | LDCC28,.5SQ |
| 封装形状 | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | SQUARE |
| 封装形式 | - | - | IN-LINE | IN-LINE | IN-LINE | - | CHIP CARRIER |
| 峰值回流温度（摄氏度） | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 电源 | - | - | 5 V | 5 V | 5 V | - | 5 V |
| 可编程逻辑类型 | - | - | OT PLD | OT PLD | OT PLD | - | OT PLD |
| 传播延迟 | - | - | 35 ns | 40 ns | 35 ns | - | 35 ns |
| 认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | - | - | 5.715 mm | 5.715 mm | 5.08 mm | - | 4.57 mm |
| 最大供电电压 | - | - | 5.25 V | 5.5 V | 5.25 V | - | 5.25 V |
| 最小供电电压 | - | - | 4.75 V | 4.5 V | 4.75 V | - | 4.75 V |
| 标称供电电压 | - | - | 5 V | 5 V | 5 V | - | 5 V |
| 表面贴装 | - | - | NO | NO | NO | - | YES |
| 技术 | - | - | TTL | TTL | TTL | - | TTL |
| 温度等级 | - | - | COMMERCIAL EXTENDED | MILITARY | COMMERCIAL EXTENDED | - | COMMERCIAL EXTENDED |
| 端子面层 | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 端子形式 | - | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | J BEND |
| 端子节距 | - | - | 2.54 mm | 2.54 mm | 2.54 mm | - | 1.27 mm |
| 端子位置 | - | - | DUAL | DUAL | DUAL | - | QUAD |
| 处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 宽度 | - | - | 7.62 mm | 7.62 mm | 7.62 mm | - | 11.43 mm |
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