1.8 A HALF BRIDGE BASED PRPHL DRVR, DSO10
1.8 A 半桥PRPHL驱动, DSO10
| 参数名称 | 属性值 |
| 功能数量 | 1 |
| 端子数量 | 10 |
| 最大供电电压1 | 14 V |
| 最小供电电压1 | 9 V |
| 额定供电电压1 | 12 V |
| 导通时间 | 0.0560 us |
| 关断时间 | 0.0560 us |
| 加工封装描述 | 4 X 4 MM, LLP-10 |
| 状态 | TRANSFERRED |
| 包装形状 | SQUARE |
| 包装尺寸 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 表面贴装 | Yes |
| 端子形式 | NO LEAD |
| 端子间距 | 0.8000 mm |
| 端子涂层 | TIN LEAD |
| 端子位置 | DUAL |
| 包装材料 | UNSPECIFIED |
| 最大供电电压2 | 114 V |
| 最小供电电压2 | 7 V |
| 额定供电电压2 | 12 V |
| 接口类型 | HALF BRIDGE BASED PRPHL DRVR |
| 内置保护 | UNDER VOLTAGE |
| 输出电流流动方向 | SOURCE AND SINK |
| 额定输出峰值电流限制 | 1.8 A |
| LM5104 | LM5104M | LM5104MX | LM5104SD | LM5104SDX | |
|---|---|---|---|---|---|
| 描述 | 1.8 A HALF BRIDGE BASED PRPHL DRVR, DSO10 | 1.8 A HALF BRIDGE BASED PRPHL DRVR, DSO10 | 1.8 A HALF BRIDGE BASED PRPHL DRVR, DSO10 | 1.8 A HALF BRIDGE BASED PRPHL DRVR, DSO10 | 1.8 A HALF BRIDGE BASED PRPHL DRVR, DSO10 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 10 | 8 | 8 | 10 | 10 |
| 表面贴装 | Yes | YES | YES | YES | YES |
| 端子形式 | NO LEAD | GULL WING | GULL WING | NO LEAD | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 内置保护 | UNDER VOLTAGE | UNDER VOLTAGE | UNDER VOLTAGE | UNDER VOLTAGE | UNDER VOLTAGE |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | - | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
| 包装说明 | - | SOP, SOP8,.25 | MS-012AA, SOIC-8 | 4 X 4 MM, LLP-10 | 4 X 4 MM, LLP-10 |
| Reach Compliance Code | - | not_compliant | not_compliant | _compli | not_compliant |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 |
| 接口集成电路类型 | - | HALF BRIDGE BASED PERIPHERAL DRIVER | HALF BRIDGE BASED PERIPHERAL DRIVER | HALF BRIDGE BASED PERIPHERAL DRIVER | HALF BRIDGE BASED PERIPHERAL DRIVER |
| JESD-30 代码 | - | R-PDSO-G8 | R-PDSO-G8 | S-XDSO-N10 | S-XDSO-N10 |
| JESD-609代码 | - | e0 | e0 | e0 | e0 |
| 长度 | - | 4.902 mm | 4.902 mm | 4 mm | 4 mm |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 |
| 输出电流流向 | - | SOURCE AND SINK | SOURCE AND SINK | SOURCE AND SINK | SOURCE AND SINK |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | - | SOP | SOP | HVSON | HVSON |
| 封装等效代码 | - | SOP8,.25 | SOP8,.25 | SOLCC10,.16,32 | SOLCC10,.16,32 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | - | 235 | 235 | 260 | 260 |
| 电源 | - | 12 V | 12 V | 12 V | 12 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 | - | 14 V | 14 V | 14 V | 14 V |
| 最小供电电压 | - | 9 V | 9 V | 9 V | 9 V |
| 标称供电电压 | - | 12 V | 12 V | 12 V | 12 V |
| 电源电压1-最大 | - | 114 V | 114 V | 114 V | 114 V |
| 电源电压1-分钟 | - | 7 V | 7 V | 7 V | 7 V |
| 电源电压1-Nom | - | 12 V | 12 V | 12 V | 12 V |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子节距 | - | 1.27 mm | 1.27 mm | 0.8 mm | 0.8 mm |
| 处于峰值回流温度下的最长时间 | - | 30 | 30 | 40 | 40 |
| 断开时间 | - | 0.056 µs | 0.056 µs | 0.056 µs | 0.056 µs |
| 接通时间 | - | 0.056 µs | 0.056 µs | 0.056 µs | 0.056 µs |
| 宽度 | - | 3.9 mm | 3.9 mm | 4 mm | 4 mm |
| 标称输出峰值电流 | - | - | 1.8 A | 1.8 A | 1.8 A |
| 座面最大高度 | - | - | 1.753 mm | 0.8 mm | 0.8 mm |
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