FIFO, 4KX9, 30ns, Asynchronous, CMOS, 0.400 INCH, FP-28
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | DFP |
| 包装说明 | DFP, FL28,.4 |
| 针数 | 28 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 最长访问时间 | 30 ns |
| 周期时间 | 40 ns |
| JESD-30 代码 | R-XDFP-F28 |
| JESD-609代码 | e0 |
| 内存密度 | 36864 bi |
| 内存集成电路类型 | OTHER FIFO |
| 内存宽度 | 9 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 4096 words |
| 字数代码 | 4000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 4KX9 |
| 可输出 | NO |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DFP |
| 封装等效代码 | FL28,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.3 mm |
| 最大待机电流 | 0.005 A |
| 最大压摆率 | 0.11 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 总剂量 | 30k Rad(Si) V |
| 宽度 | 10.16 mm |
| MMDP-67204HV-30 | SMDP-67204HV-30SB | SMCP-67204HV-30SB | MMCP-67204HV-30 | MMCP-67204HV-15 | SMDP-67204HV-15SB | MMDP-67204HV-15 | SMCP-67204HV-15SB | |
|---|---|---|---|---|---|---|---|---|
| 描述 | FIFO, 4KX9, 30ns, Asynchronous, CMOS, 0.400 INCH, FP-28 | FIFO, 4KX9, 30ns, Asynchronous, CMOS, 0.400 INCH, FP-28 | FIFO, 4KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28 | FIFO, 4KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28 | FIFO, 4KX9, 15ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28 | FIFO, 4KX9, 15ns, Asynchronous, CMOS, 0.400 INCH, FP-28 | FIFO, 4KX9, 15ns, Asynchronous, CMOS, 0.400 INCH, FP-28 | FIFO, 4KX9, 15ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DFP | DFP | DIP | DIP | DIP | DFP | DFP | DIP |
| 包装说明 | DFP, FL28,.4 | DFP, FL28,.4 | DIP, DIP28,.3 | DIP, DIP28,.3 | DIP, DIP28,.3 | DFP, FL28,.4 | DFP, FL28,.4 | DIP, DIP28,.3 |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | compli | compliant | compliant | compliant | compliant | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 30 ns | 30 ns | 30 ns | 30 ns | 15 ns | 15 ns | 15 ns | 15 ns |
| 周期时间 | 40 ns | 40 ns | 40 ns | 40 ns | 25 ns | 25 ns | 25 ns | 25 ns |
| JESD-30 代码 | R-XDFP-F28 | R-XDFP-F28 | R-CDIP-T28 | R-CDIP-T28 | R-CDIP-T28 | R-XDFP-F28 | R-XDFP-F28 | R-CDIP-T28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 36864 bi | 36864 bit | 36864 bit | 36864 bit | 36864 bit | 36864 bi | 36864 bi | 36864 bi |
| 内存集成电路类型 | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| 内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
| 字数代码 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 4KX9 | 4KX9 | 4KX9 | 4KX9 | 4KX9 | 4KX9 | 4KX9 | 4KX9 |
| 可输出 | NO | NO | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | DFP | DIP | DIP | DIP | DFP | DFP | DIP |
| 封装等效代码 | FL28,.4 | FL28,.4 | DIP28,.3 | DIP28,.3 | DIP28,.3 | FL28,.4 | FL28,.4 | DIP28,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.3 mm | 3.3 mm | 3.94 mm | 3.94 mm | 3.94 mm | 3.3 mm | 3.3 mm | 3.94 mm |
| 最大待机电流 | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A |
| 最大压摆率 | 0.11 mA | 0.11 mA | 0.11 mA | 0.11 mA | 0.12 mA | 0.12 mA | 0.12 mA | 0.12 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | NO | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 总剂量 | 30k Rad(Si) V | 30k Rad(Si) V | 30k Rad(Si) V | 30k Rad(Si) V | 30k Rad(Si) V | 30k Rad(Si) V | 30k Rad(Si) V | 30k Rad(Si) V |
| 宽度 | 10.16 mm | 10.16 mm | 7.62 mm | 7.62 mm | 7.62 mm | 10.16 mm | 10.16 mm | 7.62 mm |
| 厂商名称 | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
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