IC LVC/LCX/Z SERIES, DUAL 1-INPUT INVERT GATE, BGA6, DSBGA-6, Gate
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | VFBGA, BGA5,2X3,20 |
| 针数 | 6 |
| Reach Compliance Code | unknown |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-XBGA-B6 |
| 长度 | 1.4 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | INVERTER |
| 最大I（ol） | 0.024 A |
| 功能数量 | 2 |
| 输入次数 | 1 |
| 端子数量 | 6 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA5,2X3,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 包装方法 | TAPE AND REEL |
| 电源 | 3.3 V |
| 传播延迟（tpd） | 8 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 座面最大高度 | 0.5 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 宽度 | 0.9 mm |
| SN74LVC2G04MYEPREP | SN74LVC2G04MDBVREP | SN74LVC2G04MYZAREP | SN74LVC2G04MYZPREP | SN74LVC2G04MDRLREP | |
|---|---|---|---|---|---|
| 描述 | IC LVC/LCX/Z SERIES, DUAL 1-INPUT INVERT GATE, BGA6, DSBGA-6, Gate | IC LVC/LCX/Z SERIES, DUAL 1-INPUT INVERT GATE, PDSO6, SOT-23, 6 PIN, Gate | LVC/LCX/Z SERIES, DUAL 1-INPUT INVERT GATE, BGA6, LEAD FREE, DSBGA-6 | IC LVC/LCX/Z SERIES, DUAL 1-INPUT INVERT GATE, BGA6, LEAD FREE, DSBGA-6, Gate | LVC/LCX/Z SERIES, DUAL 1-INPUT INVERT GATE, PDSO6, SOT-563, 6 PIN |
| 零件包装代码 | BGA | SOT-23 | BGA | BGA | SOT |
| 包装说明 | VFBGA, BGA5,2X3,20 | LSSOP, TSOP6,.11,37 | VFBGA, BGA5,2X3,20 | VFBGA, BGA5,2X3,20 | VSOF, FL6,.047,20 |
| 针数 | 6 | 6 | 6 | 6 | 6 |
| Reach Compliance Code | unknown | compliant | unknown | unknown | unknown |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | R-XBGA-B6 | R-PDSO-G6 | R-XBGA-B6 | R-XBGA-B6 | R-PDSO-F6 |
| 长度 | 1.4 mm | 2.9 mm | 1.4 mm | 1.4 mm | 1.6 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER |
| 最大I（ol） | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
| 功能数量 | 2 | 2 | 2 | 2 | 2 |
| 输入次数 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 6 | 6 | 6 | 6 | 6 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | VFBGA | LSSOP | VFBGA | VFBGA | VSOF |
| 封装等效代码 | BGA5,2X3,20 | TSOP6,.11,37 | BGA5,2X3,20 | BGA5,2X3,20 | FL6,.047,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, VERY THIN PROFILE |
| 包装方法 | TAPE AND REEL | TR | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 传播延迟（tpd） | 8 ns | 8 ns | 8 ns | 8 ns | 8 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | NO | NO | NO | NO | NO |
| 座面最大高度 | 0.5 mm | 1.45 mm | 0.5 mm | 0.5 mm | 0.6 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | BALL | GULL WING | BALL | BALL | FLAT |
| 端子节距 | 0.5 mm | 0.95 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | DUAL | BOTTOM | BOTTOM | DUAL |
| 宽度 | 0.9 mm | 1.6 mm | 0.9 mm | 0.9 mm | 1.2 mm |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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