VME Bus Controller, CMOS, CBGA324, CERAMIC, BGA-324
| 参数名称 | 属性值 |
| 厂商名称 | Tundra Semiconductor Corp |
| 包装说明 | CERAMIC, BGA-324 |
| Reach Compliance Code | unknown |
| 地址总线宽度 | 64 |
| 总线兼容性 | PCI |
| 最大时钟频率 | 33 MHz |
| 外部数据总线宽度 | 64 |
| JESD-30 代码 | S-CBGA-B324 |
| 长度 | 21 mm |
| 端子数量 | 324 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | BGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.5 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | BALL |
| 端子节距 | 1 mm |
| 端子位置 | BOTTOM |
| 宽度 | 21 mm |
| uPs/uCs/外围集成电路类型 | BUS CONTROLLER, VME |
| CA91C142-33IB | CA91C142-25EE | CA91C142-33CB | CA91C142-33CE | CA91C142-33IE | CA91C142-25EB | |
|---|---|---|---|---|---|---|
| 描述 | VME Bus Controller, CMOS, CBGA324, CERAMIC, BGA-324 | VME Bus Controller, CMOS, PBGA313, PLASTIC, BGA-313 | VME Bus Controller, CMOS, CBGA324, CERAMIC, BGA-324 | VME Bus Controller, CMOS, PBGA313, PLASTIC, BGA-313 | VME Bus Controller, CMOS, PBGA313, PLASTIC, BGA-313 | VME Bus Controller, CMOS, CBGA324, CERAMIC, BGA-324 |
| 包装说明 | CERAMIC, BGA-324 | PLASTIC, BGA-313 | CERAMIC, BGA-324 | PLASTIC, BGA-313 | PLASTIC, BGA-313 | CERAMIC, BGA-324 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 地址总线宽度 | 64 | 64 | 64 | 64 | 64 | 64 |
| 总线兼容性 | PCI | PCI | PCI | PCI | PCI | PCI |
| 最大时钟频率 | 33 MHz | 25 MHz | 33 MHz | 33 MHz | 33 MHz | 25 MHz |
| 外部数据总线宽度 | 64 | 64 | 64 | 64 | 64 | 64 |
| JESD-30 代码 | S-CBGA-B324 | S-PBGA-B313 | S-CBGA-B324 | S-PBGA-B313 | S-PBGA-B313 | S-CBGA-B324 |
| 长度 | 21 mm | 35 mm | 21 mm | 35 mm | 35 mm | 21 mm |
| 端子数量 | 324 | 313 | 324 | 313 | 313 | 324 |
| 最高工作温度 | 85 °C | 125 °C | 70 °C | 70 °C | 85 °C | 125 °C |
| 最低工作温度 | -40 °C | -55 °C | - | - | -40 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | BGA | IBGA | BGA | IBGA | IBGA | BGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY, INTERSTITIAL PITCH | GRID ARRAY | GRID ARRAY, INTERSTITIAL PITCH | GRID ARRAY, INTERSTITIAL PITCH | GRID ARRAY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.5 mm | 3.5 mm | 3.5 mm | 3.5 mm | 3.5 mm | 3.5 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | MILITARY | COMMERCIAL | COMMERCIAL | INDUSTRIAL | MILITARY |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 1 mm | 2.54 mm | 1 mm | 2.54 mm | 2.54 mm | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 宽度 | 21 mm | 35 mm | 21 mm | 35 mm | 35 mm | 21 mm |
| uPs/uCs/外围集成电路类型 | BUS CONTROLLER, VME | BUS CONTROLLER, VME | BUS CONTROLLER, VME | BUS CONTROLLER, VME | BUS CONTROLLER, VME | BUS CONTROLLER, VME |
| 厂商名称 | Tundra Semiconductor Corp | Tundra Semiconductor Corp | - | Tundra Semiconductor Corp | Tundra Semiconductor Corp | Tundra Semiconductor Corp |
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