D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, CDFP20,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| Objectid | 1449151658 |
| 包装说明 | DFP, FL20,.3 |
| Reach Compliance Code | unknown |
| YTEOL | 0 |
| JESD-30 代码 | R-GDFP-F20 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 功能数量 | 8 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装等效代码 | FL20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 触发器类型 | POSITIVE EDGE |
| SN54S383W | SN54S383L883B | SN54S383J | SN54S383J883B | SN74S383J | SN74S383N | SN54S383L | SN54S383W883B | |
|---|---|---|---|---|---|---|---|---|
| 描述 | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, CDFP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, MQCC20, | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, CDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, CDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, CDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, PDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, MQCC20, | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, CDFP20, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DFP, FL20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | DFP, FL20,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-GDFP-F20 | S-MQCC-N20 | R-GDIP-T20 | R-GDIP-T20 | R-GDIP-T20 | R-PDIP-T20 | S-MQCC-N20 | R-GDFP-F20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 功能数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | - | - | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | METAL | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | METAL | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP | QCCN | DIP | DIP | DIP | DIP | QCCN | DFP |
| 封装等效代码 | FL20,.3 | LCC20,.35SQ | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | LCC20,.35SQ | FL20,.3 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | FLATPACK | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | YES | NO | NO | NO | NO | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | FLAT |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 厂商名称 | - | - | - | Monolithic Memories | Monolithic Memories | Monolithic Memories | Monolithic Memories | Monolithic Memories |
| 峰值回流温度（摄氏度） | - | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 处于峰值回流温度下的最长时间 | - | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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