DaVinci Digital Media System-on-Chip 361-NFBGA 0 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | LFBGA, BGA361,19X19,32 |
| 针数 | 361 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.A.2 |
| Factory Lead Time | 1 week |
| Base Number Matches | 1 |
| TMS320DM6446BZWT | TMS320DM6446AZWT | TMS320DM6446AZWTA | TMS320DM6446ZWT | TMS320DM6446BZWT8 | TMS320DM6446BZWTA | |
|---|---|---|---|---|---|---|
| 描述 | DaVinci Digital Media System-on-Chip 361-NFBGA 0 to 85 | DaVinci Digital Media System-on-Chip 361-NFBGA 0 to 85 | DaVinci Digital Media System-on-Chip 361-NFBGA -40 to 105 | Digital Signal Processors & Controllers - DSP, DSC Dig Media System- on-Chip | DaVinci Digital Media System-on-Chip 361-NFBGA 0 to 85 | DaVinci Digital Media System-on-Chip 361-NFBGA -40 to 105 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | LFBGA, BGA361,19X19,32 | LFBGA, BGA361,19X19,32 | LFBGA, BGA361,19X19,32 | LFBGA, BGA361,19X19,32 | BGA-361 | LFBGA, BGA361,19X19,32 |
| 针数 | 361 | 361 | 361 | 361 | 361 | 361 |
| Reach Compliance Code | compliant | compli | compli | unknow | compliant | compliant |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| ECCN代码 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | - | 3A991.A.2 | 3A991.A.2 |
| Factory Lead Time | 1 week | 1 week | 1 week | - | 1 week | 1 week |
| 位大小 | - | 32 | 32 | 32 | 32 | - |
| 格式 | - | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | - |
| JESD-30 代码 | - | S-PBGA-B361 | S-PBGA-B361 | S-PBGA-B361 | S-PBGA-B361 | - |
| 长度 | - | 16 mm | 16 mm | 16 mm | 16 mm | - |
| 湿度敏感等级 | - | 3 | 3 | 3 | 3 | - |
| 端子数量 | - | 361 | 361 | 361 | 361 | - |
| 最高工作温度 | - | 85 °C | 105 °C | 85 °C | 85 °C | - |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | - | LFBGA | LFBGA | LFBGA | LFBGA | - |
| 封装等效代码 | - | BGA361,19X19,32 | BGA361,19X19,32 | BGA361,19X19,32 | BGA361,19X19,32 | - |
| 封装形状 | - | SQUARE | SQUARE | SQUARE | SQUARE | - |
| 封装形式 | - | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | - |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 | - |
| 电源 | - | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | 1.3,1.8,3.3 V | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| RAM（字数） | - | 16384 | 16384 | 16384 | 16384 | - |
| 座面最大高度 | - | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | - |
| 最大供电电压 | - | 1.26 V | 1.26 V | 1.26 V | 1.26 V | - |
| 最小供电电压 | - | 1.14 V | 1.14 V | 1.14 V | 1.14 V | - |
| 标称供电电压 | - | 1.2 V | 1.2 V | 1.2 V | 1.2 V | - |
| 表面贴装 | - | YES | YES | YES | YES | - |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | - | OTHER | INDUSTRIAL | OTHER | OTHER | - |
| 端子形式 | - | BALL | BALL | BALL | BALL | - |
| 端子节距 | - | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | - |
| 端子位置 | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | - | 16 mm | 16 mm | 16 mm | 16 mm | - |
| uPs/uCs/外围集成电路类型 | - | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | - |
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