OT PLD, 30ns, PAL-Type, TTL, CDIP24, SLIM, CERAMIC, DIP-24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | AMD(超微) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP24,.3 |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 架构 | PAL-TYPE |
| 最大时钟频率 | 22 MHz |
| JESD-30 代码 | R-CDIP-T24 |
| JESD-609代码 | e0 |
| 长度 | 31.9405 mm |
| 专用输入次数 | 11 |
| I/O 线路数量 | 10 |
| 输入次数 | 22 |
| 输出次数 | 10 |
| 产品条款数 | 132 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 11 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 可编程逻辑类型 | OT PLD |
| 传播延迟 | 30 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| AMPAL22V10ADE | AMPAL22V10DCB | AMPAL22V10DE | AMPAL22V10LC | AMPAL22V10LE | AMPAL22V10ADCB | AMPAL22V10ALC | AMPAL22V10ALE | |
|---|---|---|---|---|---|---|---|---|
| 描述 | OT PLD, 30ns, PAL-Type, TTL, CDIP24, SLIM, CERAMIC, DIP-24 | OT PLD, 35ns, PAL-Type, TTL, CDIP24, SLIM, CERAMIC, DIP-24 | OT PLD, 40ns, PAL-Type, TTL, CDIP24, SLIM, CERAMIC, DIP-24 | OT PLD, 35ns, PAL-Type, TTL, CQCC28, CERAMIC, LCC-28 | OT PLD, 40ns, PAL-Type, TTL, CQCC28, CERAMIC, LCC-28 | OT PLD, 25ns, PAL-Type, TTL, CDIP24, SLIM, CERAMIC, DIP-24 | OT PLD, 25ns, PAL-Type, TTL, CQCC28, CERAMIC, LCC-28 | OT PLD, 30ns, PAL-Type, TTL, CQCC28, CERAMIC, LCC-28 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | DIP | DIP | QLCC | QLCC | DIP | QLCC | QLCC |
| 包装说明 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | QCCN, LCC28,.45SQ | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | QCCN, LCC28,.45SQ |
| 针数 | 24 | 24 | 24 | 28 | 28 | 24 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| 最大时钟频率 | 22 MHz | 18 MHz | 16.5 MHz | 18 MHz | 16.5 MHz | 28.5 MHz | 28.5 MHz | 22 MHz |
| JESD-30 代码 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | S-CQCC-N28 | S-CQCC-N28 | R-CDIP-T24 | S-CQCC-N28 | S-CQCC-N28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 31.9405 mm | 31.9405 mm | 31.9405 mm | 11.43 mm | 11.43 mm | 31.9405 mm | 11.43 mm | 11.43 mm |
| 专用输入次数 | 11 | 11 | 11 | 11 | 11 | 11 | 11 | 11 |
| I/O 线路数量 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 输入次数 | 22 | 22 | 22 | 22 | 22 | 22 | 22 | 22 |
| 输出次数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 产品条款数 | 132 | 132 | 132 | 132 | 132 | 132 | 132 | 132 |
| 端子数量 | 24 | 24 | 24 | 28 | 28 | 24 | 28 | 28 |
| 最高工作温度 | 125 °C | 75 °C | 125 °C | 75 °C | 125 °C | 75 °C | 75 °C | 125 °C |
| 组织 | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DIP | DIP | QCCN | QCCN | DIP | QCCN | QCCN |
| 封装等效代码 | DIP24,.3 | DIP24,.3 | DIP24,.3 | LCC28,.45SQ | LCC28,.45SQ | DIP24,.3 | LCC28,.45SQ | LCC28,.45SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 可编程逻辑类型 | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD |
| 传播延迟 | 30 ns | 35 ns | 40 ns | 35 ns | 40 ns | 25 ns | 25 ns | 30 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 2.54 mm | 2.54 mm | 5.08 mm | 2.54 mm | 2.54 mm |
| 最大供电电压 | 5.5 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | YES | YES | NO | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | COMMERCIAL EXTENDED | MILITARY | COMMERCIAL EXTENDED | MILITARY | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | QUAD | DUAL | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 11.43 mm | 11.43 mm | 7.62 mm | 11.43 mm | 11.43 mm |
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