100 mA, 30 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB
100 mA, 30 V, PNP, 硅, 小信号晶体管, TO-236AB
| 参数名称 | 属性值 |
| 端子数量 | 3 |
| 晶体管极性 | PNP |
| 最大集电极电流 | 0.1000 A |
| 最大集电极发射极电压 | 30 V |
| 加工封装描述 | 塑料 PACKAGE-3 |
| 无铅 | Yes |
| 欧盟RoHS规范 | Yes |
| 中国RoHS规范 | Yes |
| 状态 | ACTIVE |
| 包装形状 | 矩形的 |
| 包装尺寸 | SMALL OUTLINE |
| 表面贴装 | Yes |
| 端子形式 | GULL WING |
| 端子涂层 | 锡 |
| 端子位置 | 双 |
| 包装材料 | 塑料/环氧树脂 |
| 结构 | 单一的 |
| 元件数量 | 1 |
| 晶体管应用 | 放大器 |
| 晶体管元件材料 | 硅 |
| 最大环境功耗 | 0.2500 W |
| 晶体管类型 | 通用小信号 |
| 最小直流放大倍数 | 420 |
| 额定交叉频率 | 100 MHz |
| BC859B/AU,215 | BC859C,215 | BC859C,235 | BC860B,215 | BC860B,235 | BC859B,215 | BC859B/A2,215 | |
|---|---|---|---|---|---|---|---|
| 描述 | 100 mA, 30 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 100 mA, 30 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 100 mA, 30 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 100 mA, 30 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 100 mA, 45 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 100 mA, 30 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 100 mA, 30 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB |
| 端子数量 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 表面贴装 | Yes | YES | YES | YES | YES | YES | Yes |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子位置 | 双 | DUAL | DUAL | DUAL | DUAL | DUAL | 双 |
| 元件数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 晶体管应用 | 放大器 | AMPLIFIER | AMPLIFIER | AMPLIFIER | AMPLIFIER | AMPLIFIER | 放大器 |
| 晶体管元件材料 | 硅 | SILICON | SILICON | SILICON | SILICON | SILICON | 硅 |
| Brand Name | - | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | - |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | 符合 | - |
| 厂商名称 | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - |
| 零件包装代码 | - | TO-236 | TO-236 | TO-236 | TO-236 | TO-236 | - |
| 包装说明 | - | PLASTIC PACKAGE-3 | SMALL OUTLINE, R-PDSO-G3 | PLASTIC PACKAGE-3 | SMALL OUTLINE, R-PDSO-G3 | PLASTIC PACKAGE-3 | - |
| 针数 | - | 3 | 3 | 3 | 3 | 3 | - |
| 制造商包装代码 | - | SOT23 | SOT23 | SOT23 | SOT23 | SOT23 | - |
| Reach Compliance Code | - | compli | compli | compli | compli | compli | - |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| 其他特性 | - | LOW NOISE | LOW NOISE | LOW NOISE | LOW NOISE | LOW NOISE | - |
| 最大集电极电流 (IC) | - | 0.1 A | 0.1 A | 0.1 A | 0.1 A | 0.1 A | - |
| 集电极-发射极最大电压 | - | 30 V | 30 V | 45 V | 45 V | 30 V | - |
| 配置 | - | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | - |
| 最小直流电流增益 (hFE) | - | 420 | 420 | 220 | 220 | 220 | - |
| JEDEC-95代码 | - | TO-236AB | TO-236AB | TO-236AB | TO-236AB | TO-236AB | - |
| JESD-30 代码 | - | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | - |
| JESD-609代码 | - | e3 | e3 | e3 | e3 | e3 | - |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 | 1 | - |
| 最高工作温度 | - | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | - |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 | 260 | - |
| 极性/信道类型 | - | PNP | PNP | PNP | PNP | PNP | - |
| 最大功率耗散 (Abs) | - | 0.3 W | 0.25 W | 0.3 W | 0.25 W | 0.3 W | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 端子面层 | - | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | - |
| 处于峰值回流温度下的最长时间 | - | 40 | 40 | 40 | 40 | 40 | - |
| 标称过渡频率 (fT) | - | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | - |
| VCEsat-Max | - | 0.65 V | 0.65 V | 0.65 V | 0.65 V | 0.65 V | - |
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