Multiplexer, LS Series, 4-Func, 2 Line Input, 1 Line Output, True Output, TTL, CQCC20, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 厂商名称 | Motorola ( NXP ) |
| 包装说明 | QCCN, |
| Reach Compliance Code | unknown |
| 系列 | LS |
| JESD-30 代码 | S-CQCC-N20 |
| 长度 | 8.89 mm |
| 逻辑集成电路类型 | MULTIPLEXER |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 输出次数 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 传播延迟（tpd） | 48 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.9 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 8.89 mm |
| JM38510/30903B2A | 7600201 | 54LS157/BFAJC | 54LS157/BEAJC | 442BA8XBBN | JM38510/30903BFA | |
|---|---|---|---|---|---|---|
| 描述 | Multiplexer, LS Series, 4-Func, 2 Line Input, 1 Line Output, True Output, TTL, CQCC20, CERAMIC, LCC-20 | LS SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT | LS SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDFP16, CERFLAT-16 | LS SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDIP16, CERDIP-16 | Linear Motion 1/4 Watt Composition Slide Controls | LS SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDFP16, CERFLAT-16 |
| 厂商名称 | Motorola ( NXP ) | Motorola ( NXP ) | - | Motorola ( NXP ) | - | Motorola ( NXP ) |
| 包装说明 | QCCN, | , | DFP, FL16,.3 | DIP, DIP16,.3 | - | DFP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | - | unknown |
| 系列 | LS | LS | LS | LS | - | LS |
| JESD-30 代码 | S-CQCC-N20 | - | R-GDFP-F16 | R-GDIP-T16 | - | R-GDFP-F16 |
| 长度 | 8.89 mm | - | 9.65 mm | 19.3 mm | - | 9.65 mm |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | - | MULTIPLEXER |
| 功能数量 | 4 | 4 | 4 | 4 | - | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | - | 2 |
| 输出次数 | 1 | 1 | 1 | 1 | - | 1 |
| 端子数量 | 20 | - | 16 | 16 | - | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | - | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | - | -55 °C |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | - | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCN | - | DFP | DIP | - | DFP |
| 封装形状 | SQUARE | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | CHIP CARRIER | - | FLATPACK | IN-LINE | - | FLATPACK |
| 传播延迟（tpd） | 48 ns | 48 ns | 48 ns | 48 ns | - | 48 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 1.9 mm | - | 2.15 mm | 4.19 mm | - | 2.15 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | - | 5 V |
| 表面贴装 | YES | - | YES | NO | - | YES |
| 技术 | TTL | TTL | TTL | TTL | - | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | - | MILITARY |
| 端子形式 | NO LEAD | - | FLAT | THROUGH-HOLE | - | FLAT |
| 端子节距 | 1.27 mm | - | 1.27 mm | 2.54 mm | - | 1.27 mm |
| 端子位置 | QUAD | - | DUAL | DUAL | - | DUAL |
| 宽度 | 8.89 mm | - | 6.415 mm | 7.62 mm | - | 6.415 mm |
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