LS SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDFP16, CERFLAT-16
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
零件包装代码 | DFP |
包装说明 | DFP, FL16,.3 |
针数 | 16 |
Reach Compliance Code | unknown |
系列 | LS |
JESD-30 代码 | R-GDFP-F16 |
JESD-609代码 | e0 |
长度 | 9.65 mm |
逻辑集成电路类型 | MULTIPLEXER |
最大I(ol) | 0.004 A |
功能数量 | 4 |
输入次数 | 2 |
输出次数 | 1 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | TRUE |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DFP |
封装等效代码 | FL16,.3 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
最大电源电流(ICC) | 16 mA |
Prop。Delay @ Nom-Sup | 27 ns |
传播延迟(tpd) | 48 ns |
认证状态 | Not Qualified |
筛选级别 | 38535Q/M;38534H;883B |
座面最大高度 | 2.15 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 6.415 mm |
Base Number Matches | 1 |
54LS157/BFAJC | 7600201 | 54LS157/BEAJC | 442BA8XBBN | JM38510/30903BFA | JM38510/30903B2A | |
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描述 | LS SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDFP16, CERFLAT-16 | LS SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT | LS SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDIP16, CERDIP-16 | Linear Motion 1/4 Watt Composition Slide Controls | LS SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDFP16, CERFLAT-16 | Multiplexer, LS Series, 4-Func, 2 Line Input, 1 Line Output, True Output, TTL, CQCC20, CERAMIC, LCC-20 |
包装说明 | DFP, FL16,.3 | , | DIP, DIP16,.3 | - | DFP, | QCCN, |
Reach Compliance Code | unknown | unknown | unknown | - | unknown | unknown |
系列 | LS | LS | LS | - | LS | LS |
JESD-30 代码 | R-GDFP-F16 | - | R-GDIP-T16 | - | R-GDFP-F16 | S-CQCC-N20 |
长度 | 9.65 mm | - | 19.3 mm | - | 9.65 mm | 8.89 mm |
逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | - | MULTIPLEXER | MULTIPLEXER |
功能数量 | 4 | 4 | 4 | - | 4 | 4 |
输入次数 | 2 | 2 | 2 | - | 2 | 2 |
输出次数 | 1 | 1 | 1 | - | 1 | 1 |
端子数量 | 16 | - | 16 | - | 16 | 20 |
最高工作温度 | 125 °C | 125 °C | 125 °C | - | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | - | -55 °C | -55 °C |
输出极性 | TRUE | TRUE | TRUE | - | TRUE | TRUE |
封装主体材料 | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DFP | - | DIP | - | DFP | QCCN |
封装形状 | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR | SQUARE |
封装形式 | FLATPACK | - | IN-LINE | - | FLATPACK | CHIP CARRIER |
传播延迟(tpd) | 48 ns | 48 ns | 48 ns | - | 48 ns | 48 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
座面最大高度 | 2.15 mm | - | 4.19 mm | - | 2.15 mm | 1.9 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | - | 5 V | 5 V |
表面贴装 | YES | - | NO | - | YES | YES |
技术 | TTL | TTL | TTL | - | TTL | TTL |
温度等级 | MILITARY | MILITARY | MILITARY | - | MILITARY | MILITARY |
端子形式 | FLAT | - | THROUGH-HOLE | - | FLAT | NO LEAD |
端子节距 | 1.27 mm | - | 2.54 mm | - | 1.27 mm | 1.27 mm |
端子位置 | DUAL | - | DUAL | - | DUAL | QUAD |
宽度 | 6.415 mm | - | 7.62 mm | - | 6.415 mm | 8.89 mm |
厂商名称 | - | Motorola ( NXP ) | Motorola ( NXP ) | - | Motorola ( NXP ) | Motorola ( NXP ) |
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