EEPROM Card, 256X16, Serial, CMOS, PDSO8
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | ROHM(罗姆半导体) |
包装说明 | TSSOP, TSSOP8,.25 |
Reach Compliance Code | compliant |
其他特性 | IT ALSO OPERATES AT 0.5MHZ AT 1.8MIN |
最大时钟频率 (fCLK) | 2 MHz |
数据保留时间-最小值 | 40 |
耐久性 | 1000000 Write/Erase Cycles |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e3 |
长度 | 4.4 mm |
内存密度 | 4096 bit |
内存集成电路类型 | EEPROM CARD |
内存宽度 | 16 |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 8 |
字数 | 256 words |
字数代码 | 256 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 256X16 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP8,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 | SERIAL |
峰值回流温度(摄氏度) | 225 |
电源 | 2/5 V |
编程电压 | 2.7 V |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
串行总线类型 | MICROWIRE |
最大待机电流 | 0.000002 A |
最大压摆率 | 0.0045 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3 mm |
最长写入周期时间 (tWC) | 5 ms |
写保护 | SOFTWARE |
BR93L66RFVT-WE1 | BR93L66RFV-WE1 | BR93L66FV-WE1 | BR93L66FVT-WE1 | BR93L66FJ-WE1 | BR93L66RFJ-WE1 | BR93L66F-WE1 | |
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描述 | EEPROM Card, 256X16, Serial, CMOS, PDSO8 | EEPROM, 256X16, Serial, CMOS, PDSO8 | EEPROM, 256X16, Serial, CMOS, PDSO8 | EEPROM Card, 256X16, Serial, CMOS, PDSO8 | EEPROM, 256X16, Serial, CMOS, PDSO8 | EEPROM, 256X16, Serial, CMOS, PDSO8 | EEPROM, 256X16, Serial, CMOS, PDSO8 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
包装说明 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 | TSSOP-8 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
数据保留时间-最小值 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
内存密度 | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
内存集成电路类型 | EEPROM CARD | EEPROM | EEPROM | EEPROM CARD | EEPROM | EEPROM | EEPROM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
字数 | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words |
字数代码 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 256X16 | 256X16 | 256X16 | 256X16 | 256X16 | 256X16 | 256X16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | TSSOP | TSSOP | SOP | SOP | SOP |
封装等效代码 | TSSOP8,.25 | TSSOP8,.25 | TSSOP8,.25 | TSSOP8,.25 | SOP8,.25 | SOP8,.25 | SOP8,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
电源 | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
串行总线类型 | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
最大待机电流 | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A |
最大压摆率 | 0.0045 mA | 0.0045 mA | 0.0045 mA | 0.0045 mA | 0.0045 mA | 0.0045 mA | 0.0045 mA |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.635 mm | 0.635 mm | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
写保护 | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE |
厂商名称 | ROHM(罗姆半导体) | - | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) |
JESD-609代码 | e3 | e2 | e2 | e3 | - | - | - |
端子面层 | Matte Tin (Sn) | Tin/Copper (Sn/Cu) | Tin/Copper (Sn/Cu) | Matte Tin (Sn) | - | - | - |
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