EEPROM, 256X16, Serial, CMOS, PDSO8
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
包装说明 | TSSOP, TSSOP8,.25 |
Reach Compliance Code | compliant |
数据保留时间-最小值 | 40 |
耐久性 | 1000000 Write/Erase Cycles |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e2 |
内存密度 | 4096 bit |
内存集成电路类型 | EEPROM |
内存宽度 | 16 |
端子数量 | 8 |
字数 | 256 words |
字数代码 | 256 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 256X16 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP8,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 | SERIAL |
电源 | 2/5 V |
认证状态 | Not Qualified |
串行总线类型 | MICROWIRE |
最大待机电流 | 0.000002 A |
最大压摆率 | 0.0045 mA |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Copper (Sn/Cu) |
端子形式 | GULL WING |
端子节距 | 0.635 mm |
端子位置 | DUAL |
写保护 | SOFTWARE |
Base Number Matches | 1 |
BR93L66RFV-WE1 | BR93L66FV-WE1 | BR93L66FVT-WE1 | BR93L66FJ-WE1 | BR93L66RFJ-WE1 | BR93L66F-WE1 | BR93L66RFVT-WE1 | |
---|---|---|---|---|---|---|---|
描述 | EEPROM, 256X16, Serial, CMOS, PDSO8 | EEPROM, 256X16, Serial, CMOS, PDSO8 | EEPROM Card, 256X16, Serial, CMOS, PDSO8 | EEPROM, 256X16, Serial, CMOS, PDSO8 | EEPROM, 256X16, Serial, CMOS, PDSO8 | EEPROM, 256X16, Serial, CMOS, PDSO8 | EEPROM Card, 256X16, Serial, CMOS, PDSO8 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
包装说明 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 | TSSOP-8 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 | TSSOP, TSSOP8,.25 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
数据保留时间-最小值 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
内存密度 | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM CARD | EEPROM | EEPROM | EEPROM | EEPROM CARD |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
字数 | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words |
字数代码 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 256X16 | 256X16 | 256X16 | 256X16 | 256X16 | 256X16 | 256X16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | TSSOP | SOP | SOP | SOP | TSSOP |
封装等效代码 | TSSOP8,.25 | TSSOP8,.25 | TSSOP8,.25 | SOP8,.25 | SOP8,.25 | SOP8,.25 | TSSOP8,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
电源 | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
串行总线类型 | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
最大待机电流 | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A |
最大压摆率 | 0.0045 mA | 0.0045 mA | 0.0045 mA | 0.0045 mA | 0.0045 mA | 0.0045 mA | 0.0045 mA |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.635 mm | 0.635 mm | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
写保护 | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE |
JESD-609代码 | e2 | e2 | e3 | - | - | - | e3 |
端子面层 | Tin/Copper (Sn/Cu) | Tin/Copper (Sn/Cu) | Matte Tin (Sn) | - | - | - | Matte Tin (Sn) |
厂商名称 | - | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) |
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