D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, 0.083 X 0.099 INCH, DIE-16
| 参数名称 | 属性值 |
| 厂商名称 | AMD(超微) |
| 零件包装代码 | DIE |
| 包装说明 | DIE, DIE OR CHIP |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 其他特性 | STANDARD TOTEM OUTPUTS ALSO AVAILABLE |
| 系列 | TTL/H/L |
| JESD-30 代码 | R-XUUC-N16 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 位数 | 4 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIE |
| 封装等效代码 | DIE OR CHIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | UNCASED CHIP |
| 最大电源电流（ICC） | 28 mA |
| 传播延迟（tpd） | 40 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子位置 | UPPER |
| 触发器类型 | POSITIVE EDGE |
| 最小 fmax | 25 MHz |
| AM25LS2518XM | AM25LS2518PC | AM25LS2518DC | AM25LS2518LM | AM25LS2518XC | AM25LS2518DM | AM25LS2518FM | AM25LS2518LC | |
|---|---|---|---|---|---|---|---|---|
| 描述 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, 0.083 X 0.099 INCH, DIE-16 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, PDIP16, PLASTIC, DIP-16 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, CDIP16, HERMETIC SEALED, CERDIP-16 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, PQCC20, 0.353 X 0.353 INCH, LCC-20 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, 0.083 X 0.099 INCH, DIE-16 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, CDIP16, HERMETIC SEALED, CERDIP-16 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, FP-16 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, PQCC20, 0.353 X 0.353 INCH, LCC-20 |
| 零件包装代码 | DIE | DIP | DIP | QLCC | DIE | DIP | DFP | QLCC |
| 包装说明 | DIE, DIE OR CHIP | DIP, DIP16,.3 | HERMETIC SEALED, CERDIP-16 | QCCN, | DIE, DIE OR CHIP | HERMETIC SEALED, CERDIP-16 | DFP, FL16,.3 | QCCN, LCC20,.35SQ |
| 针数 | 16 | 16 | 16 | 20 | 16 | 16 | 16 | 20 |
| Reach Compliance Code | unknown | unknow | unknow | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | STANDARD TOTEM OUTPUTS ALSO AVAILABLE | STANDARD TOTEM OUTPUTS ALSO AVAILABLE | STANDARD TOTEM OUTPUTS ALSO AVAILABLE | STANDARD TOTEM OUTPUTS ALSO AVAILABLE | STANDARD TOTEM OUTPUTS ALSO AVAILABLE | STANDARD TOTEM OUTPUTS ALSO AVAILABLE | STANDARD TOTEM OUTPUTS ALSO AVAILABLE | STANDARD TOTEM OUTPUTS ALSO AVAILABLE |
| 系列 | TTL/H/L | TTL/H/L | LS | TTL/H/L | TTL/H/L | LS | TTL/H/L | TTL/H/L |
| JESD-30 代码 | R-XUUC-N16 | R-PDIP-T16 | R-CDIP-T16 | S-PQCC-N20 | R-XUUC-N16 | R-CDIP-T16 | R-XDFP-F16 | S-PQCC-N20 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 20 | 16 | 16 | 16 | 20 |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C | 125 °C | 70 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | DIE | DIP | DIP | QCCN | DIE | DIP | DFP | QCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | UNCASED CHIP | IN-LINE | IN-LINE | CHIP CARRIER | UNCASED CHIP | IN-LINE | FLATPACK | CHIP CARRIER |
| 最大电源电流（ICC） | 28 mA | 28 mA | 28 mA | 28 mA | 28 mA | 28 mA | 28 mA | 28 mA |
| 传播延迟（tpd） | 40 ns | 35 ns | 35 ns | 40 ns | 35 ns | 40 ns | 40 ns | 35 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | YES | NO | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL |
| 端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | FLAT | NO LEAD |
| 端子位置 | UPPER | DUAL | DUAL | QUAD | UPPER | DUAL | DUAL | QUAD |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 最小 fmax | 25 MHz | 30 MHz | 30 MHz | 25 MHz | 30 MHz | 25 MHz | 25 MHz | 30 MHz |
| 厂商名称 | AMD(超微) | - | AMD(超微) | - | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
| 封装等效代码 | DIE OR CHIP | DIP16,.3 | DIP16,.3 | - | DIE OR CHIP | DIP16,.3 | FL16,.3 | LCC20,.35SQ |
| 是否Rohs认证 | - | 不符合 | 不符合 | - | - | 不符合 | 不符合 | 不符合 |
| JESD-609代码 | - | e0 | e0 | - | - | e0 | e0 | e0 |
| 长度 | - | 19.304 mm | 19.6215 mm | 8.89 mm | - | 19.6215 mm | - | 8.89 mm |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 座面最大高度 | - | 5.08 mm | 5.08 mm | 2.54 mm | - | 5.08 mm | - | 2.54 mm |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子节距 | - | 2.54 mm | 2.54 mm | 1.27 mm | - | 2.54 mm | 1.27 mm | 1.27 mm |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 7.62 mm | 7.62 mm | 8.89 mm | - | 7.62 mm | - | 8.89 mm |
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