D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, CDIP16, HERMETIC SEALED, CERDIP-16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | AMD(超微) |
| 零件包装代码 | DIP |
| 包装说明 | HERMETIC SEALED, CERDIP-16 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 其他特性 | STANDARD TOTEM OUTPUTS ALSO AVAILABLE |
| 系列 | LS |
| JESD-30 代码 | R-CDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.6215 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 位数 | 4 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 最大电源电流（ICC） | 28 mA |
| 传播延迟（tpd） | 40 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class C |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 7.62 mm |
| 最小 fmax | 25 MHz |
| AM25LS2518DM | AM25LS2518PC | AM25LS2518DC | AM25LS2518LM | AM25LS2518XC | AM25LS2518FM | AM25LS2518LC | AM25LS2518XM | |
|---|---|---|---|---|---|---|---|---|
| 描述 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, CDIP16, HERMETIC SEALED, CERDIP-16 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, PDIP16, PLASTIC, DIP-16 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, CDIP16, HERMETIC SEALED, CERDIP-16 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, PQCC20, 0.353 X 0.353 INCH, LCC-20 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, 0.083 X 0.099 INCH, DIE-16 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, FP-16 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, PQCC20, 0.353 X 0.353 INCH, LCC-20 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, 0.083 X 0.099 INCH, DIE-16 |
| 零件包装代码 | DIP | DIP | DIP | QLCC | DIE | DFP | QLCC | DIE |
| 包装说明 | HERMETIC SEALED, CERDIP-16 | DIP, DIP16,.3 | HERMETIC SEALED, CERDIP-16 | QCCN, | DIE, DIE OR CHIP | DFP, FL16,.3 | QCCN, LCC20,.35SQ | DIE, DIE OR CHIP |
| 针数 | 16 | 16 | 16 | 20 | 16 | 16 | 20 | 16 |
| Reach Compliance Code | unknown | unknow | unknow | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | STANDARD TOTEM OUTPUTS ALSO AVAILABLE | STANDARD TOTEM OUTPUTS ALSO AVAILABLE | STANDARD TOTEM OUTPUTS ALSO AVAILABLE | STANDARD TOTEM OUTPUTS ALSO AVAILABLE | STANDARD TOTEM OUTPUTS ALSO AVAILABLE | STANDARD TOTEM OUTPUTS ALSO AVAILABLE | STANDARD TOTEM OUTPUTS ALSO AVAILABLE | STANDARD TOTEM OUTPUTS ALSO AVAILABLE |
| 系列 | LS | TTL/H/L | LS | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L |
| JESD-30 代码 | R-CDIP-T16 | R-PDIP-T16 | R-CDIP-T16 | S-PQCC-N20 | R-XUUC-N16 | R-XDFP-F16 | S-PQCC-N20 | R-XUUC-N16 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 20 | 16 | 16 | 20 | 16 |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C | 125 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | DIP | DIP | DIP | QCCN | DIE | DFP | QCCN | DIE |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | UNCASED CHIP | FLATPACK | CHIP CARRIER | UNCASED CHIP |
| 最大电源电流（ICC） | 28 mA | 28 mA | 28 mA | 28 mA | 28 mA | 28 mA | 28 mA | 28 mA |
| 传播延迟（tpd） | 40 ns | 35 ns | 35 ns | 40 ns | 35 ns | 40 ns | 35 ns | 40 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | YES | YES | YES | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | FLAT | NO LEAD | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | UPPER | DUAL | QUAD | UPPER |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 最小 fmax | 25 MHz | 30 MHz | 30 MHz | 25 MHz | 30 MHz | 25 MHz | 30 MHz | 25 MHz |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | - | 不符合 | 不符合 | - |
| 厂商名称 | AMD(超微) | - | AMD(超微) | - | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
| JESD-609代码 | e0 | e0 | e0 | - | - | e0 | e0 | - |
| 长度 | 19.6215 mm | 19.304 mm | 19.6215 mm | 8.89 mm | - | - | 8.89 mm | - |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | - | DIE OR CHIP | FL16,.3 | LCC20,.35SQ | DIE OR CHIP |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | - |
| 座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 2.54 mm | - | - | 2.54 mm | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | - | 1.27 mm | 1.27 mm | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 8.89 mm | - | - | 8.89 mm | - |
模拟电子
RF/无线
WindowsCE
嵌入式系统
嵌入式系统
嵌入式系统
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
