D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, PQCC20, 0.353 X 0.353 INCH, LCC-20
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | AMD(超微) |
零件包装代码 | QLCC |
包装说明 | QCCN, LCC20,.35SQ |
针数 | 20 |
Reach Compliance Code | unknown |
其他特性 | STANDARD TOTEM OUTPUTS ALSO AVAILABLE |
系列 | TTL/H/L |
JESD-30 代码 | S-PQCC-N20 |
JESD-609代码 | e0 |
长度 | 8.89 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP |
位数 | 4 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCN |
封装等效代码 | LCC20,.35SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | NOT SPECIFIED |
最大电源电流(ICC) | 28 mA |
传播延迟(tpd) | 35 ns |
认证状态 | Not Qualified |
座面最大高度 | 2.54 mm |
最大供电电压 (Vsup) | 5.25 V |
最小供电电压 (Vsup) | 4.75 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
触发器类型 | POSITIVE EDGE |
宽度 | 8.89 mm |
最小 fmax | 30 MHz |
AM25LS2518LC | AM25LS2518PC | AM25LS2518DC | AM25LS2518LM | AM25LS2518XC | AM25LS2518DM | AM25LS2518FM | AM25LS2518XM | |
---|---|---|---|---|---|---|---|---|
描述 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, PQCC20, 0.353 X 0.353 INCH, LCC-20 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, PDIP16, PLASTIC, DIP-16 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, CDIP16, HERMETIC SEALED, CERDIP-16 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, PQCC20, 0.353 X 0.353 INCH, LCC-20 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, 0.083 X 0.099 INCH, DIE-16 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, CDIP16, HERMETIC SEALED, CERDIP-16 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, FP-16 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, True Output, TTL, 0.083 X 0.099 INCH, DIE-16 |
零件包装代码 | QLCC | DIP | DIP | QLCC | DIE | DIP | DFP | DIE |
包装说明 | QCCN, LCC20,.35SQ | DIP, DIP16,.3 | HERMETIC SEALED, CERDIP-16 | QCCN, | DIE, DIE OR CHIP | HERMETIC SEALED, CERDIP-16 | DFP, FL16,.3 | DIE, DIE OR CHIP |
针数 | 20 | 16 | 16 | 20 | 16 | 16 | 16 | 16 |
Reach Compliance Code | unknown | unknow | unknow | unknown | unknown | unknown | unknown | unknown |
其他特性 | STANDARD TOTEM OUTPUTS ALSO AVAILABLE | STANDARD TOTEM OUTPUTS ALSO AVAILABLE | STANDARD TOTEM OUTPUTS ALSO AVAILABLE | STANDARD TOTEM OUTPUTS ALSO AVAILABLE | STANDARD TOTEM OUTPUTS ALSO AVAILABLE | STANDARD TOTEM OUTPUTS ALSO AVAILABLE | STANDARD TOTEM OUTPUTS ALSO AVAILABLE | STANDARD TOTEM OUTPUTS ALSO AVAILABLE |
系列 | TTL/H/L | TTL/H/L | LS | TTL/H/L | TTL/H/L | LS | TTL/H/L | TTL/H/L |
JESD-30 代码 | S-PQCC-N20 | R-PDIP-T16 | R-CDIP-T16 | S-PQCC-N20 | R-XUUC-N16 | R-CDIP-T16 | R-XDFP-F16 | R-XUUC-N16 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
位数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 16 | 16 | 20 | 16 | 16 | 16 | 16 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | UNSPECIFIED |
封装代码 | QCCN | DIP | DIP | QCCN | DIE | DIP | DFP | DIE |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | UNCASED CHIP | IN-LINE | FLATPACK | UNCASED CHIP |
最大电源电流(ICC) | 28 mA | 28 mA | 28 mA | 28 mA | 28 mA | 28 mA | 28 mA | 28 mA |
传播延迟(tpd) | 35 ns | 35 ns | 35 ns | 40 ns | 35 ns | 40 ns | 40 ns | 40 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | NO | YES | YES | NO | YES | YES |
技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY |
端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | FLAT | NO LEAD |
端子位置 | QUAD | DUAL | DUAL | QUAD | UPPER | DUAL | DUAL | UPPER |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
最小 fmax | 30 MHz | 30 MHz | 30 MHz | 25 MHz | 30 MHz | 25 MHz | 25 MHz | 25 MHz |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | - | 不符合 | 不符合 | - |
厂商名称 | AMD(超微) | - | AMD(超微) | - | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
JESD-609代码 | e0 | e0 | e0 | - | - | e0 | e0 | - |
长度 | 8.89 mm | 19.304 mm | 19.6215 mm | 8.89 mm | - | 19.6215 mm | - | - |
封装等效代码 | LCC20,.35SQ | DIP16,.3 | DIP16,.3 | - | DIE OR CHIP | DIP16,.3 | FL16,.3 | DIE OR CHIP |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | - |
座面最大高度 | 2.54 mm | 5.08 mm | 5.08 mm | 2.54 mm | - | 5.08 mm | - | - |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | - | 2.54 mm | 1.27 mm | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | - |
宽度 | 8.89 mm | 7.62 mm | 7.62 mm | 8.89 mm | - | 7.62 mm | - | - |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved