Single-Chip Handsfree Phone CMOS Integrated Circuit
参数名称 | 属性值 |
厂商名称 | AMS |
零件包装代码 | QFP |
包装说明 | QFP, |
针数 | 44 |
Reach Compliance Code | unknow |
JESD-30 代码 | S-PQFP-G44 |
端子数量 | 44 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QFP |
封装形状 | SQUARE |
封装形式 | FLATPACK |
认证状态 | Not Qualified |
表面贴装 | YES |
电信集成电路类型 | TELEPHONE MULTIFUNCTION CIRCUIT |
端子形式 | GULL WING |
端子位置 | QUAD |
AS2525 | AS2525Q | AS2525F | AS2525_1 | |
---|---|---|---|---|
描述 | Single-Chip Handsfree Phone CMOS Integrated Circuit | Single-Chip Handsfree Phone CMOS Integrated Circuit | Single-Chip Handsfree Phone CMOS Integrated Circuit | Single-Chip Handsfree Phone CMOS Integrated Circuit |
厂商名称 | AMS | AMS | AMS | - |
零件包装代码 | QFP | QFP | DIE | - |
包装说明 | QFP, | QFP, QFP44(UNSPEC) | DIE, | - |
Reach Compliance Code | unknow | unknow | unknow | - |
JESD-30 代码 | S-PQFP-G44 | S-PQFP-G44 | X-XUUC-N | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | - |
封装代码 | QFP | QFP | DIE | - |
封装形状 | SQUARE | SQUARE | UNSPECIFIED | - |
封装形式 | FLATPACK | FLATPACK | UNCASED CHIP | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - |
表面贴装 | YES | YES | YES | - |
电信集成电路类型 | TELEPHONE MULTIFUNCTION CIRCUIT | TELEPHONE MULTIFUNCTION CIRCUIT | TELEPHONE MULTIFUNCTION CIRCUIT | - |
端子形式 | GULL WING | GULL WING | NO LEAD | - |
端子位置 | QUAD | QUAD | UPPER | - |
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