Dual-Port SRAM, 32KX16, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-100
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP |
| 包装说明 | LFQFP, |
| 针数 | 100 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.2.B |
| 最长访问时间 | 20 ns |
| JESD-30 代码 | S-PQFP-G100 |
| JESD-609代码 | e3 |
| 长度 | 14 mm |
| 内存密度 | 524288 bit |
| 内存集成电路类型 | DUAL-PORT SRAM |
| 内存宽度 | 16 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 100 |
| 字数 | 32768 words |
| 字数代码 | 32000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 32KX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.6 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 14 mm |
| Base Number Matches | 1 |
| IDT70V27S20PFGI | IDT70V27L20BFGI | IDT70V27S35PFGI | IDT70V27S35BFGI | IDT70V27S20BFGI | IDT70V27L35BFGI | |
|---|---|---|---|---|---|---|
| 描述 | Dual-Port SRAM, 32KX16, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-100 | Dual-Port SRAM, 32KX16, 20ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, FBGA-144 | Dual-Port SRAM, 32KX16, 35ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-100 | Dual-Port SRAM, 32KX16, 35ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, FBGA-144 | Dual-Port SRAM, 32KX16, 20ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, FBGA-144 | Dual-Port SRAM, 32KX16, 35ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, FBGA-144 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP | BGA | QFP | BGA | BGA | BGA |
| 包装说明 | LFQFP, | LFBGA, | LFQFP, | LFBGA, | LFBGA, | LFBGA, |
| 针数 | 100 | 144 | 100 | 144 | 144 | 144 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A991.B.2.B | 3A991.B.2.B | EAR99 | EAR99 | 3A991.B.2.B | EAR99 |
| 最长访问时间 | 20 ns | 20 ns | 35 ns | 35 ns | 20 ns | 35 ns |
| JESD-30 代码 | S-PQFP-G100 | S-PBGA-B144 | S-PQFP-G100 | S-PBGA-B144 | S-PBGA-B144 | S-PBGA-B144 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 14 mm | 12 mm | 14 mm | 12 mm | 12 mm | 12 mm |
| 内存密度 | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit |
| 内存集成电路类型 | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 100 | 144 | 100 | 144 | 144 | 144 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 32KX16 | 32KX16 | 32KX16 | 32KX16 | 32KX16 | 32KX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFQFP | LFBGA | LFQFP | LFBGA | LFBGA | LFBGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 1.5 mm | 1.6 mm | 1.5 mm | 1.5 mm | 1.5 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | MATTE TIN | Matte Tin (Sn) | MATTE TIN | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | BALL | GULL WING | BALL | BALL | BALL |
| 端子节距 | 0.5 mm | 0.8 mm | 0.5 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | QUAD | BOTTOM | QUAD | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 14 mm | 12 mm | 14 mm | 12 mm | 12 mm | 12 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
