UVPROM, 128KX16, 150ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40
| 参数名称 | 属性值 |
| 厂商名称 | AMD(超微) |
| 零件包装代码 | DIP |
| 包装说明 | WDIP, DIP40,.6 |
| 针数 | 40 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 150 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-GDIP-T40 |
| JESD-609代码 | e0 |
| 长度 | 52.2605 mm |
| 内存密度 | 2097152 bit |
| 内存集成电路类型 | UVPROM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 40 |
| 字数 | 131072 words |
| 字数代码 | 128000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 128KX16 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | WDIP |
| 封装等效代码 | DIP40,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE, WINDOW |
| 并行/串行 | PARALLEL |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 5.588 mm |
| 最大待机电流 | 0.00015 A |
| 最大压摆率 | 0.06 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 15.24 mm |
| Base Number Matches | 1 |
| 5962-9214003MQA | 5962-9214001MXA | 5962-9214001MQA | 5962-9214002MXA | PTN1010K2083DGW0 | 5962-9214003MXA | |
|---|---|---|---|---|---|---|
| 描述 | UVPROM, 128KX16, 150ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 | UVPROM, 128KX16, 250ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 | UVPROM, 128KX16, 250ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 | UVPROM, 128KX16, 200ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 | Fixed Resistor, Thin Film, 0.5W, 208000ohm, 150V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 1010, CHIP | UVPROM, 128KX16, 150ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 |
| 包装说明 | WDIP, DIP40,.6 | WQCCN, LCC44,.65SQ | WDIP, DIP40,.6 | WQCCN, LCC44,.65SQ | CHIP | WQCCN, LCC44,.65SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | compliant | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 端子数量 | 40 | 44 | 40 | 44 | 2 | 44 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 155 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装形式 | IN-LINE, WINDOW | CHIP CARRIER, WINDOW | IN-LINE, WINDOW | CHIP CARRIER, WINDOW | SMT | CHIP CARRIER, WINDOW |
| 表面贴装 | NO | YES | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | THIN FILM | CMOS |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | Gold (Au) - with Nickel (Ni) barrier | TIN LEAD |
| 厂商名称 | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | - | AMD(超微) |
| 零件包装代码 | DIP | LCC | DIP | LCC | - | LCC |
| 针数 | 40 | 44 | 40 | 44 | - | 44 |
| 最长访问时间 | 150 ns | 250 ns | 250 ns | 200 ns | - | 150 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | - | COMMON |
| JESD-30 代码 | R-GDIP-T40 | S-CQCC-N44 | R-GDIP-T40 | S-CQCC-N44 | - | S-CQCC-N44 |
| JESD-609代码 | e0 | e0 | e0 | e0 | - | e0 |
| 长度 | 52.2605 mm | 16.51 mm | 52.2605 mm | 16.51 mm | - | 16.51 mm |
| 内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | - | 2097152 bit |
| 内存集成电路类型 | UVPROM | UVPROM | UVPROM | UVPROM | - | UVPROM |
| 内存宽度 | 16 | 16 | 16 | 16 | - | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | - | 1 |
| 字数 | 131072 words | 131072 words | 131072 words | 131072 words | - | 131072 words |
| 字数代码 | 128000 | 128000 | 128000 | 128000 | - | 128000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS |
| 组织 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | - | 128KX16 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | WDIP | WQCCN | WDIP | WQCCN | - | WQCCN |
| 封装等效代码 | DIP40,.6 | LCC44,.65SQ | DIP40,.6 | LCC44,.65SQ | - | LCC44,.65SQ |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | - | SQUARE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL |
| 电源 | 5 V | 5 V | 5 V | 5 V | - | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | - | MIL-STD-883 |
| 座面最大高度 | 5.588 mm | 3.556 mm | 5.588 mm | 3.556 mm | - | 3.556 mm |
| 最大待机电流 | 0.00015 A | 0.00015 A | 0.00015 A | 0.00015 A | - | 0.00015 A |
| 最大压摆率 | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | - | 0.06 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | - | 5 V |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | - | MILITARY |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD | - | NO LEAD |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | - | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | - | QUAD |
| 宽度 | 15.24 mm | 16.51 mm | 15.24 mm | 16.51 mm | - | 16.51 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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