EE PLD, 15ns, CMOS, PQCC28, PLASTIC, LCC-28
| 参数名称 | 属性值 |
| 零件包装代码 | QLCC |
| 包装说明 | QCCJ, |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| 其他特性 | 10 MACROCELLS; SHARED INPUT/CLOCK |
| JESD-30 代码 | S-PQCC-J28 |
| 长度 | 11.5062 mm |
| 专用输入次数 | 11 |
| I/O 线路数量 | 10 |
| 端子数量 | 28 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 11 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 可编程逻辑类型 | EE PLD |
| 传播延迟 | 15 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.369 mm |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 2.7 V |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 11.5062 mm |
| Base Number Matches | 1 |
| PEEL22V10AZ3J-15 | PEEL22V10AZ3J-25 | PEEL22V10AZ3P-15 | PEEL22V10AZ3P-25 | PEEL22V10AZ3S-15 | PEEL22V10AZ3S-25 | |
|---|---|---|---|---|---|---|
| 描述 | EE PLD, 15ns, CMOS, PQCC28, PLASTIC, LCC-28 | EE PLD, 25ns, CMOS, PQCC28, PLASTIC, LCC-28 | EE PLD, 15ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | EE PLD, 25ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | EE PLD, 15ns, CMOS, PDSO24, SOIC-24 | EE PLD, 25ns, CMOS, PDSO24, SOIC-24 |
| 零件包装代码 | QLCC | QLCC | DIP | DIP | SOIC | SOIC |
| 包装说明 | QCCJ, | QCCJ, | DIP, | DIP, | SOP, | SOP, |
| 针数 | 28 | 28 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | 10 MACROCELLS; SHARED INPUT/CLOCK | 10 MACROCELLS; SHARED INPUT/CLOCK | 10 MACROCELLS; SHARED INPUT/CLOCK | 10 MACROCELLS; SHARED INPUT/CLOCK | 10 MACROCELLS; SHARED INPUT/CLOCK | 10 MACROCELLS; SHARED INPUT/CLOCK |
| JESD-30 代码 | S-PQCC-J28 | S-PQCC-J28 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-G24 | R-PDSO-G24 |
| 长度 | 11.5062 mm | 11.5062 mm | 31.75 mm | 31.75 mm | 15.4 mm | 15.4 mm |
| 专用输入次数 | 11 | 11 | 11 | 11 | 11 | 11 |
| I/O 线路数量 | 10 | 10 | 10 | 10 | 10 | 10 |
| 端子数量 | 28 | 28 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QCCJ | DIP | DIP | SOP | SOP |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 15 ns | 25 ns | 15 ns | 25 ns | 15 ns | 25 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | NO | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 11.5062 mm | 11.5062 mm | 7.62 mm | 7.62 mm | 7.5 mm | 7.5 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 座面最大高度 | 4.369 mm | 4.369 mm | - | - | 2.65 mm | 2.65 mm |
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