HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Cirrus Logic(凌云半导体) |
零件包装代码 | QFP |
包装说明 | LFQFP, |
针数 | 208 |
Reach Compliance Code | compli |
具有ADC | YES |
地址总线宽度 | 28 |
位大小 | 32 |
最大时钟频率 | 13 MHz |
DAC 通道 | YES |
DMA 通道 | YES |
外部数据总线宽度 | 32 |
JESD-30 代码 | S-PQFP-G208 |
JESD-609代码 | e0 |
长度 | 28 mm |
I/O 线路数量 | 70 |
端子数量 | 208 |
最高工作温度 | 70 °C |
最低工作温度 | |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LFQFP |
封装形状 | SQUARE |
封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 240 |
认证状态 | Not Qualified |
ROM可编程性 | FLASH |
座面最大高度 | 1.6 mm |
最大供电电压 | 2.7 V |
最小供电电压 | 2.3 V |
标称供电电压 | 2.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 28 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
EP7309 是一款专为低功耗应用设计的高性能系统级芯片(SoC),它包含了多种特性来帮助设计者优化整个系统的功耗。以下是一些优化 EP7309 功耗管理的策略:
使用多种电源状态:
动态时钟管理:
使用内存和存储:
优化用户界面:
有效使用串行端口:
数字音频接口(DAI):
电源管理:
使用 MaverickKey™ 技术:
利用内部定时器和 PWM 控制:
硬件调试接口:
选择合适的封装:
软件优化:
通过上述方法,可以有效地管理和优化 EP7309 在各种应用中的功耗,从而延长电池寿命或减少能量消耗。
EP7309-CV-C | EP7309-CB-C | EP7309-CR-C | EP7309-EB-C | EP7309-ER-C | EP7309-EV-C | EP7309-IB-C | EP7309-IR-C | EP7309-IV-C | |
---|---|---|---|---|---|---|---|---|---|
描述 | HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE | HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE | HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE | HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE | HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE | HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE | HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE | HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE | HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Cirrus Logic(凌云半导体) | Cirrus Logic(凌云半导体) | Cirrus Logic(凌云半导体) | Cirrus Logic(凌云半导体) | Cirrus Logic(凌云半导体) | Cirrus Logic(凌云半导体) | Cirrus Logic(凌云半导体) | Cirrus Logic(凌云半导体) | Cirrus Logic(凌云半导体) |
零件包装代码 | QFP | BGA | BGA | BGA | BGA | QFP | BGA | BGA | QFP |
包装说明 | LFQFP, | BGA, | TFBGA, | BGA, | TFBGA, | LFQFP, | BGA, | TFBGA, | LFQFP, |
针数 | 208 | 256 | 204 | 256 | 204 | 208 | 256 | 204 | 208 |
Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compli | compli |
JESD-30 代码 | S-PQFP-G208 | S-PBGA-B256 | S-PBGA-B204 | S-PBGA-B256 | S-PBGA-B204 | S-PQFP-G208 | S-PBGA-B256 | S-PBGA-B204 | S-PQFP-G208 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 28 mm | 17 mm | 13 mm | 17 mm | 13 mm | 28 mm | 17 mm | 13 mm | 28 mm |
端子数量 | 208 | 256 | 204 | 256 | 204 | 208 | 256 | 204 | 208 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | - | - | - | -20 °C | -20 °C | -20 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LFQFP | BGA | TFBGA | BGA | TFBGA | LFQFP | BGA | TFBGA | LFQFP |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY | GRID ARRAY, THIN PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY | GRID ARRAY, THIN PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 240 | NOT SPECIFIED | 240 | NOT SPECIFIED | 240 | NOT SPECIFIED | NOT SPECIFIED | 240 | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.6 mm | 1.8 mm | 1.2 mm | 1.8 mm | 1.2 mm | 1.6 mm | 1.8 mm | 1.2 mm | 1.6 mm |
最大供电电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
最小供电电压 | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
标称供电电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | GULL WING | BALL | BALL | BALL | BALL | GULL WING | BALL | BALL | GULL WING |
端子节距 | 0.5 mm | 1 mm | 0.65 mm | 1 mm | 0.65 mm | 0.5 mm | 1 mm | 0.65 mm | 0.5 mm |
端子位置 | QUAD | BOTTOM | BOTTOM | BOTTOM | BOTTOM | QUAD | BOTTOM | BOTTOM | QUAD |
处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | 30 | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED |
宽度 | 28 mm | 17 mm | 13 mm | 17 mm | 13 mm | 28 mm | 17 mm | 13 mm | 28 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
具有ADC | YES | YES | YES | - | - | - | YES | YES | YES |
地址总线宽度 | 28 | 28 | 28 | - | - | - | 28 | 28 | 28 |
位大小 | 32 | 32 | 32 | - | - | - | 32 | 32 | 32 |
最大时钟频率 | 13 MHz | - | 13 MHz | - | - | - | 13 MHz | 13 MHz | 13 MHz |
DAC 通道 | YES | YES | YES | - | - | - | YES | YES | YES |
DMA 通道 | YES | YES | YES | - | - | - | YES | YES | YES |
外部数据总线宽度 | 32 | 32 | 32 | - | - | - | 32 | 32 | 32 |
I/O 线路数量 | 70 | 70 | 27 | - | - | - | 27 | 27 | 27 |
PWM 通道 | YES | YES | YES | - | - | - | YES | YES | YES |
ROM可编程性 | FLASH | FLASH | FLASH | - | - | - | FLASH | FLASH | FLASH |
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