EE PLD, 7.5ns, PQCC28, PLASTIC, LCC-28
参数名称 | 属性值 |
零件包装代码 | QLCC |
包装说明 | QCCJ, |
针数 | 28 |
Reach Compliance Code | unknown |
其他特性 | REGISTER PRELOAD; POWER-UP RESET |
最大时钟频率 | 91 MHz |
JESD-30 代码 | S-PQCC-J28 |
长度 | 11.5062 mm |
专用输入次数 | 11 |
I/O 线路数量 | 10 |
端子数量 | 28 |
最高工作温度 | 75 °C |
最低工作温度 | |
组织 | 11 DEDICATED INPUTS, 10 I/O |
输出函数 | MACROCELL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
可编程逻辑类型 | EE PLD |
传播延迟 | 7.5 ns |
认证状态 | COMMERCIAL |
座面最大高度 | 4.572 mm |
最大供电电压 | 3.6 V |
最小供电电压 | 3 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL EXTENDED |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
宽度 | 11.5062 mm |
Base Number Matches | 1 |
GAL22LV10C-7LJ | GAL22LV10D-4LJN | GAL22LV10D-5LJ | GAL22LV10D-4LJ | GAL22LV10C-15LJ | GAL22LV10C-15LJN | |
---|---|---|---|---|---|---|
描述 | EE PLD, 7.5ns, PQCC28, PLASTIC, LCC-28 | EE PLD, 4 ns, PQCC28, LEAD FREE, PLASTIC, LCC-28 | EE PLD, 5 ns, PQCC28, PLASTIC, LCC-28 | EE PLD, 4 ns, PQCC28, PLASTIC, LCC-28 | EE PLD, 15 ns, PQCC28, PLASTIC, LCC-28 | EE PLD, 15 ns, PQCC28, LEAD FREE, PLASTIC, LCC-28 |
零件包装代码 | QLCC | QLCC | QLCC | QLCC | QLCC | QLCC |
包装说明 | QCCJ, | QCCJ, | QCCJ, | QCCJ, | QCCJ, | QCCJ, |
针数 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
最大时钟频率 | 91 MHz | 167 MHz | 143 MHz | 167 MHz | 50 MHz | 50 MHz |
JESD-30 代码 | S-PQCC-J28 | S-PQCC-J28 | S-PQCC-J28 | S-PQCC-J28 | S-PQCC-J28 | S-PQCC-J28 |
长度 | 11.5062 mm | 11.5062 mm | 11.5062 mm | 11.5062 mm | 11.5062 mm | 11.5062 mm |
专用输入次数 | 11 | 11 | 11 | 11 | 11 | 11 |
I/O 线路数量 | 10 | 10 | 10 | 10 | 10 | 10 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 |
最高工作温度 | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C |
组织 | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O |
输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
传播延迟 | 7.5 ns | 4 ns | 5 ns | 4 ns | 15 ns | 15 ns |
认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
座面最大高度 | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm |
最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
端子形式 | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
宽度 | 11.5062 mm | 11.5062 mm | 11.5062 mm | 11.5062 mm | 11.5062 mm | 11.5062 mm |
其他特性 | REGISTER PRELOAD; POWER-UP RESET | - | REGISTER PRELOAD; POWER-UP RESET | REGISTER PRELOAD; POWER-UP RESET | REGISTER PRELOAD; POWER-UP RESET | - |
Base Number Matches | 1 | 1 | 1 | 1 | - | - |
湿度敏感等级 | - | 1 | 1 | 1 | - | 1 |
峰值回流温度(摄氏度) | - | 245 | 250 | 250 | - | 245 |
端子面层 | - | MATTE TIN | NOT SPECIFIED | TIN LEAD | NOT SPECIFIED | MATTE TIN |
处于峰值回流温度下的最长时间 | - | 40 | NOT SPECIFIED | NOT SPECIFIED | - | 40 |
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