EE PLD, 15 ns, PQCC28, PLASTIC, LCC-28
| 参数名称 | 属性值 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | QLCC |
| 包装说明 | QCCJ, |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| 其他特性 | REGISTER PRELOAD; POWER-UP RESET |
| 最大时钟频率 | 50 MHz |
| JESD-30 代码 | S-PQCC-J28 |
| 长度 | 11.5062 mm |
| 专用输入次数 | 11 |
| I/O 线路数量 | 10 |
| 端子数量 | 28 |
| 最高工作温度 | 75 °C |
| 最低工作温度 | |
| 组织 | 11 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 可编程逻辑类型 | EE PLD |
| 传播延迟 | 15 ns |
| 认证状态 | COMMERCIAL |
| 座面最大高度 | 4.572 mm |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL EXTENDED |
| 端子面层 | NOT SPECIFIED |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 11.5062 mm |
| GAL22LV10C-15LJ | GAL22LV10D-4LJN | GAL22LV10D-5LJ | GAL22LV10D-4LJ | GAL22LV10C-7LJ | GAL22LV10C-15LJN | |
|---|---|---|---|---|---|---|
| 描述 | EE PLD, 15 ns, PQCC28, PLASTIC, LCC-28 | EE PLD, 4 ns, PQCC28, LEAD FREE, PLASTIC, LCC-28 | EE PLD, 5 ns, PQCC28, PLASTIC, LCC-28 | EE PLD, 4 ns, PQCC28, PLASTIC, LCC-28 | EE PLD, 7.5ns, PQCC28, PLASTIC, LCC-28 | EE PLD, 15 ns, PQCC28, LEAD FREE, PLASTIC, LCC-28 |
| 零件包装代码 | QLCC | QLCC | QLCC | QLCC | QLCC | QLCC |
| 包装说明 | QCCJ, | QCCJ, | QCCJ, | QCCJ, | QCCJ, | QCCJ, |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 最大时钟频率 | 50 MHz | 167 MHz | 143 MHz | 167 MHz | 91 MHz | 50 MHz |
| JESD-30 代码 | S-PQCC-J28 | S-PQCC-J28 | S-PQCC-J28 | S-PQCC-J28 | S-PQCC-J28 | S-PQCC-J28 |
| 长度 | 11.5062 mm | 11.5062 mm | 11.5062 mm | 11.5062 mm | 11.5062 mm | 11.5062 mm |
| 专用输入次数 | 11 | 11 | 11 | 11 | 11 | 11 |
| I/O 线路数量 | 10 | 10 | 10 | 10 | 10 | 10 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 |
| 最高工作温度 | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C |
| 组织 | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 15 ns | 4 ns | 5 ns | 4 ns | 7.5 ns | 15 ns |
| 认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 座面最大高度 | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm |
| 最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| 端子形式 | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 宽度 | 11.5062 mm | 11.5062 mm | 11.5062 mm | 11.5062 mm | 11.5062 mm | 11.5062 mm |
| 其他特性 | REGISTER PRELOAD; POWER-UP RESET | - | REGISTER PRELOAD; POWER-UP RESET | REGISTER PRELOAD; POWER-UP RESET | REGISTER PRELOAD; POWER-UP RESET | - |
| 端子面层 | NOT SPECIFIED | MATTE TIN | NOT SPECIFIED | TIN LEAD | - | MATTE TIN |
| 湿度敏感等级 | - | 1 | 1 | 1 | - | 1 |
| 峰值回流温度（摄氏度） | - | 245 | 250 | 250 | - | 245 |
| 处于峰值回流温度下的最长时间 | - | 40 | NOT SPECIFIED | NOT SPECIFIED | - | 40 |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - |
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