64K X 8 OTP CMOS EPROM
| A276308A | A276308A-70 | A276308AL-55 | A276308A-55 | A276308A-90 | A276308AL-70 | A276308AL-90 | |
|---|---|---|---|---|---|---|---|
| 描述 | 64K X 8 OTP CMOS EPROM | 64K X 8 OTP CMOS EPROM | 64K X 8 OTP CMOS EPROM | 64K X 8 OTP CMOS EPROM | 64K X 8 OTP CMOS EPROM | 64K X 8 OTP CMOS EPROM | 64K X 8 OTP CMOS EPROM |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | - | AMICC [AMIC TECHNOLOGY] | AMICC [AMIC TECHNOLOGY] | AMICC [AMIC TECHNOLOGY] | AMICC [AMIC TECHNOLOGY] | AMICC [AMIC TECHNOLOGY] | AMICC [AMIC TECHNOLOGY] |
| 包装说明 | - | DIP, DIP28,.6 | QCCJ, LDCC32,.5X.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 |
| Reach Compliance Code | - | unknow | unknow | unknow | unknow | unknow | unknow |
| 最长访问时间 | - | 70 ns | 55 ns | 55 ns | 90 ns | 70 ns | 90 ns |
| I/O 类型 | - | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | - | R-PDIP-T28 | R-PQCC-J32 | R-PDIP-T28 | R-PDIP-T28 | R-PQCC-J32 | R-PQCC-J32 |
| 长度 | - | 37.08 mm | 13.97 mm | 37.08 mm | 37.08 mm | 13.97 mm | 13.97 mm |
| 内存密度 | - | 524288 bi | 524288 bi | 524288 bi | 524288 bi | 524288 bi | 524288 bi |
| 内存宽度 | - | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | - | 28 | 32 | 28 | 28 | 32 | 32 |
| 字数 | - | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| 字数代码 | - | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| 工作模式 | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | - | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | DIP | QCCJ | DIP | DIP | QCCJ | QCCJ |
| 封装等效代码 | - | DIP28,.6 | LDCC32,.5X.6 | DIP28,.6 | DIP28,.6 | LDCC32,.5X.6 | LDCC32,.5X.6 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| 并行/串行 | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 5.33 mm | 3.4 mm | 5.33 mm | 5.33 mm | 3.4 mm | 3.4 mm |
| 最大待机电流 | - | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| 最大压摆率 | - | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | - | NO | YES | NO | NO | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | - | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND |
| 端子节距 | - | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | - | DUAL | QUAD | DUAL | DUAL | QUAD | QUAD |
| 宽度 | - | 15.24 mm | 11.43 mm | 15.24 mm | 15.24 mm | 11.43 mm | 11.43 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 |
模拟电子
模拟电子
嵌入式系统
电源技术
单片机
Altera SoC
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