OTP ROM, 2KX8, 55ns, TTL, CQCC28,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | QCCN, LCC28,.45SQ |
| Reach Compliance Code | unknown |
| 最长访问时间 | 55 ns |
| JESD-30 代码 | S-XQCC-N28 |
| JESD-609代码 | e0 |
| 内存密度 | 16384 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 8 |
| 端子数量 | 28 |
| 字数 | 2048 words |
| 字数代码 | 2000 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 2KX8 |
| 封装主体材料 | CERAMIC |
| 封装代码 | QCCN |
| 封装等效代码 | LCC28,.45SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| 82S191A/B3A | 82S191A/BKA | 82S191A/BJA | 82S191/B3A | 82S191/BJA | 82S191/BKA | 82S191/BLA | 82S191A/BLA | |
|---|---|---|---|---|---|---|---|---|
| 描述 | OTP ROM, 2KX8, 55ns, TTL, CQCC28, | OTP ROM, 2KX8, 55ns, TTL, CDFP24, | OTP ROM, 2KX8, 55ns, TTL, CDIP24, | OTP ROM, 2KX8, 100ns, TTL, CQCC28, | OTP ROM, 2KX8, 100ns, TTL, CDIP24, | OTP ROM, 2KX8, 100ns, TTL, CDFP24, | OTP ROM, 2KX8, 100ns, TTL, CQCC28, | OTP ROM, 2KX8, 55ns, TTL, CDIP24, |
| 包装说明 | QCCN, LCC28,.45SQ | DFP, FL24,.4 | DIP, DIP24,.6 | QCCN, LCC28,.45SQ | DIP, DIP24,.6 | DFP, FL24,.4 | QCCJ, LDCC28,.5SQ | DIP, DIP24,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 55 ns | 55 ns | 55 ns | 100 ns | 100 ns | 100 ns | 100 ns | 55 ns |
| JESD-30 代码 | S-XQCC-N28 | R-XDFP-F24 | R-XDIP-T24 | S-XQCC-N28 | R-XDIP-T24 | R-XDFP-F24 | S-XQCC-J28 | R-XDIP-T24 |
| 内存密度 | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 28 | 24 | 24 | 28 | 24 | 24 | 28 | 24 |
| 字数 | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| 字数代码 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | QCCN | DFP | DIP | QCCN | DIP | DFP | QCCJ | DIP |
| 封装等效代码 | LCC28,.45SQ | FL24,.4 | DIP24,.6 | LCC28,.45SQ | DIP24,.6 | FL24,.4 | LDCC28,.5SQ | DIP24,.3 |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | CHIP CARRIER | FLATPACK | IN-LINE | CHIP CARRIER | IN-LINE | FLATPACK | CHIP CARRIER | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES | NO | YES | YES | NO |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | FLAT | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | FLAT | J BEND | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | - | e0 |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
