DDR DRAM, 32MX16, 0.45ns, CMOS, PZMA84, 8 X 13 MM, HALOGEN FREE AND ROHS COMPLIANT, FPBGA-84
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | SK Hynix(海力士) |
零件包装代码 | BGA |
包装说明 | TFBGA, BGA63,9X11,32 |
针数 | 84 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
访问模式 | FOUR BANK PAGE BURST |
最长访问时间 | 0.45 ns |
其他特性 | AUTO/SELF REFRESH |
最大时钟频率 (fCLK) | 400 MHz |
I/O 类型 | COMMON |
交错的突发长度 | 4,8 |
JESD-30 代码 | R-XZMA-N203 |
长度 | 13 mm |
内存密度 | 536870912 bit |
内存集成电路类型 | DDR DRAM |
内存宽度 | 16 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 84 |
字数 | 33554432 words |
字数代码 | 32000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 32MX16 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TFBGA |
封装等效代码 | BGA63,9X11,32 |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 1.8 V |
认证状态 | Not Qualified |
刷新周期 | 8192 |
座面最大高度 | 1.2 mm |
自我刷新 | YES |
连续突发长度 | 4,8 |
最大待机电流 | 0.008 A |
最大压摆率 | 0.34 mA |
最大供电电压 (Vsup) | 1.9 V |
最小供电电压 (Vsup) | 1.7 V |
标称供电电压 (Vsup) | 1.8 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | BALL |
端子节距 | 0.8 mm |
端子位置 | ZIG-ZAG |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 8 mm |
Base Number Matches | 1 |
H5PS5162FFR-S5 | H5PS5162FFR-E3 | H5PS5162FLFR-Y5 | H5PS5162FLFR-S5 | H5PS5162FFR-Y5 | H5PS5162FLFR-C4 | H5PS5162FLFR-S6 | H5PS5162FLFR-S6I | H5PS5162FLFR-E3 | H5PS5162FLFR-E3I | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | DDR DRAM, 32MX16, 0.45ns, CMOS, PZMA84, 8 X 13 MM, HALOGEN FREE AND ROHS COMPLIANT, FPBGA-84 | DDR DRAM, 32MX16, 0.6ns, CMOS, PZMA84, 8 X 13 MM, HALOGEN FREE AND ROHS COMPLIANT, FPBGA-84 | DDR DRAM, 32MX16, 0.45ns, CMOS, PZMA84, 8 X 13 MM, HALOGEN FREE AND ROHS COMPLIANT, FPBGA-84 | DDR DRAM, 32MX16, 0.45ns, CMOS, PZMA84, 8 X 13 MM, HALOGEN FREE AND ROHS COMPLIANT, FPBGA-84 | DDR DRAM, 32MX16, 0.45ns, CMOS, PZMA84, 8 X 13 MM, HALOGEN FREE AND ROHS COMPLIANT, FPBGA-84 | DDR DRAM, 32MX16, 0.5ns, CMOS, PZMA84, 8 X 13 MM, HALOGEN FREE AND ROHS COMPLIANT, FPBGA-84 | DDR DRAM, 32MX16, 0.4ns, CMOS, PZMA84, 8 X 13 MM, HALOGEN FREE AND ROHS COMPLIANT, FPBGA-84 | DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, | DDR DRAM, 32MX16, 0.6ns, CMOS, PZMA84, 8 X 13 MM, HALOGEN FREE AND ROHS COMPLIANT, FPBGA-84 | DDR DRAM, 32MX16, 0.6ns, CMOS, PBGA84, |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) |
包装说明 | TFBGA, BGA63,9X11,32 | TFBGA, BGA63,9X11,32 | TFBGA, BGA63,9X11,32 | TFBGA, BGA63,9X11,32 | TFBGA, BGA63,9X11,32 | TFBGA, BGA63,9X11,32 | TFBGA, BGA63,9X11,32 | FBGA, BGA84,9X15,32 | TFBGA, BGA63,9X11,32 | FBGA, BGA84,9X15,32 |
Reach Compliance Code | unknown | unknown | compliant | compliant | unknown | compliant | compliant | compliant | compliant | compli |
最长访问时间 | 0.45 ns | 0.6 ns | 0.45 ns | 0.45 ns | 0.45 ns | 0.5 ns | 0.4 ns | 0.4 ns | 0.6 ns | 0.6 ns |
最大时钟频率 (fCLK) | 400 MHz | 200 MHz | 333 MHz | 400 MHz | 333 MHz | 266 MHz | 400 MHz | 400 MHz | 200 MHz | 200 MHz |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
交错的突发长度 | 4,8 | 4,8 | 4,8 | 4,8 | 4,8 | 4,8 | 4,8 | 4,8 | 4,8 | 4,8 |
JESD-30 代码 | R-XZMA-N203 | R-XZMA-N203 | R-XZMA-N203 | R-XZMA-N203 | R-XZMA-N203 | R-XZMA-N203 | R-XZMA-N203 | R-PBGA-B84 | R-XZMA-N203 | R-PBGA-B84 |
内存密度 | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bi |
内存集成电路类型 | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
端子数量 | 84 | 84 | 84 | 84 | 84 | 84 | 84 | 84 | 84 | 84 |
字数 | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words |
字数代码 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 32MX16 | 32MX16 | 32MX16 | 32MX16 | 32MX16 | 32MX16 | 32MX16 | 32MX16 | 32MX16 | 32MX16 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TFBGA | TFBGA | TFBGA | TFBGA | TFBGA | TFBGA | TFBGA | FBGA | TFBGA | FBGA |
封装等效代码 | BGA63,9X11,32 | BGA63,9X11,32 | BGA63,9X11,32 | BGA63,9X11,32 | BGA63,9X11,32 | BGA63,9X11,32 | BGA63,9X11,32 | BGA84,9X15,32 | BGA63,9X11,32 | BGA84,9X15,32 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | GRID ARRAY, FINE PITCH | MICROELECTRONIC ASSEMBLY | GRID ARRAY, FINE PITCH |
电源 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
连续突发长度 | 4,8 | 4,8 | 4,8 | 4,8 | 4,8 | 4,8 | 4,8 | 4,8 | 4,8 | 4,8 |
最大待机电流 | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A |
最大压摆率 | 0.34 mA | 0.32 mA | 0.32 mA | 0.34 mA | 0.32 mA | 0.32 mA | 0.34 mA | 0.34 mA | 0.32 mA | 0.32 mA |
标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | YES | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | BOTTOM | ZIG-ZAG | BOTTOM |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | - | BGA | - |
针数 | 84 | 84 | 84 | 84 | 84 | 84 | 84 | - | 84 | - |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 |
访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | - | FOUR BANK PAGE BURST | - |
其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | - | AUTO/SELF REFRESH | - |
长度 | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | - | 13 mm | - |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 | - |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 | - |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | - |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | - | 1.2 mm | - |
自我刷新 | YES | YES | YES | YES | YES | YES | YES | - | YES | - |
最大供电电压 (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | - | 1.9 V | - |
最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | - | 1.7 V | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
宽度 | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | - | 8 mm | - |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - | - |
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