Serial I/O Controller, 1 Channel(s), CMOS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28
参数名称 | 属性值 |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 28 |
Reach Compliance Code | unknown |
地址总线宽度 | |
边界扫描 | NO |
外部数据总线宽度 | 8 |
JESD-30 代码 | R-CDIP-T28 |
JESD-609代码 | e0 |
长度 | 35.56 mm |
低功率模式 | NO |
串行 I/O 数 | 1 |
端子数量 | 28 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
认证状态 | Not Qualified |
座面最大高度 | 5.08 mm |
最大供电电压 | 5.25 V |
最小供电电压 | 4.75 V |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | TIN LEAD |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 15.24 mm |
uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
Base Number Matches | 1 |
HI-6010CM-01 | HI-6010J | HI-6010JTF | HI-6010C | HI-6010JT | HI-6010C-T | HI-6010JF | |
---|---|---|---|---|---|---|---|
描述 | Serial I/O Controller, 1 Channel(s), CMOS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28 | Serial I/O Controller, 1 Channel(s), CMOS, PQCC28, PLASTIC, LCC-28 | Serial I/O Controller, 1 Channel(s), CMOS, PQCC28, ROHS COMPLIANT, PLASTIC, LCC-28 | Serial I/O Controller, 1 Channel(s), CMOS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28 | Serial I/O Controller, 1 Channel(s), CMOS, PQCC28, PLASTIC, LCC-28 | Serial I/O Controller, 1 Channel(s), CMOS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28 | Serial I/O Controller, 1 Channel(s), CMOS, PQCC28, ROHS COMPLIANT, PLASTIC, LCC-28 |
零件包装代码 | DIP | QLCC | QLCC | DIP | QLCC | DIP | QLCC |
包装说明 | DIP, | QCCJ, | QCCJ, | DIP, | QCCJ, | DIP, | QCCJ, |
针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
边界扫描 | NO | NO | NO | NO | NO | NO | NO |
外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
JESD-30 代码 | R-CDIP-T28 | S-PQCC-J28 | S-PQCC-J28 | R-CDIP-T28 | S-PQCC-J28 | R-CDIP-T28 | S-PQCC-J28 |
JESD-609代码 | e0 | e0 | e3 | e4 | e0 | e4 | e3 |
长度 | 35.56 mm | 11.5062 mm | 11.5062 mm | 35.56 mm | 11.5062 mm | 35.56 mm | 11.5062 mm |
低功率模式 | NO | NO | NO | NO | NO | NO | NO |
串行 I/O 数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
最高工作温度 | 125 °C | 85 °C | 125 °C | 85 °C | 125 °C | 125 °C | 85 °C |
最低工作温度 | -55 °C | -40 °C | -55 °C | -40 °C | -55 °C | -55 °C | -40 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
封装代码 | DIP | QCCJ | QCCJ | DIP | QCCJ | DIP | QCCJ |
封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 4.394 mm | 4.394 mm | 5.08 mm | 4.394 mm | 5.08 mm | 4.394 mm |
最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | YES | NO | YES | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL |
端子面层 | TIN LEAD | TIN LEAD | MATTE TIN | GOLD | TIN LEAD | GOLD | MATTE TIN |
端子形式 | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND |
端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | QUAD | QUAD | DUAL | QUAD | DUAL | QUAD |
宽度 | 15.24 mm | 11.5062 mm | 11.5062 mm | 15.24 mm | 11.5062 mm | 15.24 mm | 11.5062 mm |
uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |
厂商名称 | - | Hokuriku | Hokuriku | - | - | Hokuriku | Hokuriku |
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