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MC145502P: 产品描述IC,PCM CODEC,SINGLE,CMOS,DIP,22PIN,PLASTIC; 产品类别无线/射频/通信电信电路; 文件大小498KB，共28页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com

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MC145502P概述

IC,PCM CODEC,SINGLE,CMOS,DIP,22PIN,PLASTIC

MC145502P规格参数

参数名称	属性值
零件包装代码	DIP
包装说明	DIP,
针数	22
Reach Compliance Code	unknown
ECCN代码	EAR99
压伸定律	A/MU-LAW
滤波器	YES
JESD-30 代码	R-PDIP-T22
长度	27.94 mm
负电源额定电压	-5 V
功能数量	1
端子数量	22
工作模式	SYNCHRONOUS/ASYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	DIP
封装形状	RECTANGULAR
封装形式	IN-LINE
认证状态	Not Qualified
座面最大高度	5.08 mm
标称供电电压	5 V
表面贴装	NO
技术	CMOS
电信集成电路类型	PCM CODEC
温度等级	INDUSTRIAL
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
宽度	10.16 mm
Base Number Matches	1

MC145502P相似产品对比

	MC145502P	MC145502L	MC145502FN	MC145500L	MC145505P	MC145505DW	MC145505L	MC145503DW	MC145503P
描述	IC,PCM CODEC,SINGLE,CMOS,DIP,22PIN,PLASTIC	A/MU-LAW, PCM CODEC, CDIP22, CERAMIC, DIP-22	IC,PCM CODEC,SINGLE,CMOS,LDCC,28PIN,PLASTIC	A/MU-LAW, PCM CODEC, CDIP16, CERAMIC, DIP-16	IC,PCM CODEC,SINGLE,CMOS,DIP,16PIN,PLASTIC	IC,PCM CODEC,SINGLE,CMOS,SOP,16PIN,PLASTIC	IC,PCM CODEC,SINGLE,CMOS,DIP,16PIN,CERAMIC	IC,PCM CODEC,SINGLE,CMOS,SOP,16PIN,PLASTIC	A/MU-LAW, PCM CODEC, PDIP16, PLASTIC, DIP-16
零件包装代码	DIP	DIP	QLCC	DIP	DIP	SOIC	DIP	SOIC	DIP
包装说明	DIP,	DIP,	QCCJ,	DIP,	DIP,	SOP,	DIP,	SOP,	DIP,
针数	22	22	28	16	16	16	16	16	16
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
压伸定律	A/MU-LAW	A/MU-LAW	A/MU-LAW	A/MU-LAW	A/MU-LAW	A/MU-LAW	A/MU-LAW	A/MU-LAW	A/MU-LAW
滤波器	YES	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 代码	R-PDIP-T22	R-GDIP-T22	S-PQCC-J28	R-GDIP-T16	R-PDIP-T16	R-PDSO-G16	R-GDIP-T16	R-PDSO-G16	R-PDIP-T16
长度	27.94 mm	27.37 mm	11.505 mm	19.3 mm	19.175 mm	10.3 mm	19.3 mm	10.3 mm	19.175 mm
功能数量	1	1	1	1	1	1	1	1	1
端子数量	22	22	28	16	16	16	16	16	16
工作模式	SYNCHRONOUS/ASYNCHRONOUS	SYNCHRONOUS/ASYNCHRONOUS	SYNCHRONOUS/ASYNCHRONOUS	SYNCHRONOUS/ASYNCHRONOUS	ASYNCHRONOUS	SYNCHRONOUS/ASYNCHRONOUS	SYNCHRONOUS/ASYNCHRONOUS	SYNCHRONOUS/ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
封装主体材料	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	DIP	DIP	QCCJ	DIP	DIP	SOP	DIP	SOP	DIP
封装形状	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	IN-LINE
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	5.08 mm	5.46 mm	4.57 mm	4.19 mm	4.44 mm	2.65 mm	4.19 mm	2.65 mm	4.44 mm
标称供电电压	5 V	5 V	5 V	5 V	12 V	5 V	5 V	5 V	12 V
表面贴装	NO	NO	YES	NO	NO	YES	NO	YES	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
电信集成电路类型	PCM CODEC	PCM CODEC	PCM CODEC	PCM CODEC	PCM CODEC	PCM CODEC	PCM CODEC	PCM CODEC	PCM CODEC
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING	THROUGH-HOLE
端子节距	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm
端子位置	DUAL	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
宽度	10.16 mm	10.16 mm	11.505 mm	7.62 mm	7.62 mm	7.5 mm	7.62 mm	7.5 mm	7.62 mm
ECCN代码	EAR99	-	EAR99	EAR99	EAR99	EAR99	-	EAR99	EAR99
负电源额定电压	-5 V	-5 V	-5 V	-5 V	-	-5 V	-5 V	-5 V	-
厂商名称	-	-	-	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)

MC145502P

MC145502P概述

MC145502P规格参数

MC145502P相似产品对比

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