64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ST(意法半导体) |
| 零件包装代码 | BGA |
| 包装说明 | 10 X 13 MM, 1 MM PITCH, TBGA-64 |
| 针数 | 64 |
| Reach Compliance Code | unknow |
| ECCN代码 | 3A991.B.1.A |
| 最长访问时间 | 150 ns |
| 其他特性 | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
| 命令用户界面 | YES |
| 通用闪存接口 | YES |
| 数据轮询 | NO |
| JESD-30 代码 | R-PBGA-B64 |
| JESD-609代码 | e1 |
| 长度 | 13 mm |
| 内存密度 | 67108864 bi |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 部门数/规模 | 64 |
| 端子数量 | 64 |
| 字数 | 4194304 words |
| 字数代码 | 4000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 4MX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TBGA |
| 封装等效代码 | BGA64,8X8,40 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE |
| 页面大小 | 4 words |
| 并行/串行 | PARALLEL |
| 电源 | 2/3.3,3.3 V |
| 编程电压 | 3 V |
| 认证状态 | Not Qualified |
| 就绪/忙碌 | YES |
| 座面最大高度 | 1.2 mm |
| 部门规模 | 1M |
| 最大待机电流 | 0.000001 A |
| 最大压摆率 | 0.05 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
| 端子形式 | BALL |
| 端子节距 | 1 mm |
| 端子位置 | BOTTOM |
| 切换位 | NO |
| 类型 | NOR TYPE |
| 宽度 | 10 mm |
| M58LV064A150ZA1T | M58LV064B150ZA6T | M58LV064B150ZA1T | M58LV064B150N6T | M58LV064B150N1T | M58LV064B | M58LV064A150ZA6T | M58LV064A150N6T | M58LV064A150N1T | M58LV064A | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories | 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories | 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories | 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories | 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories | 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories | 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories | 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories | 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories | 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories |
| 是否Rohs认证 | 符合 | 符合 | 符合 | - | - | - | 符合 | 不符合 | 不符合 | - |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | - |
| 零件包装代码 | BGA | BGA | BGA | TSOP | TSOP | - | BGA | TSOP | TSOP | - |
| 包装说明 | 10 X 13 MM, 1 MM PITCH, TBGA-64 | 10 X 13 MM, 1 MM PITCH, TBGA-80 | 10 X 13 MM, 1 MM PITCH, TBGA-80 | PLASTIC, TSOP-56 | PLASTIC, TSOP-56 | - | 10 X 13 MM, 1 MM PITCH, TBGA-64 | 14 X 20 MM, PLASTIC, TSOP-56 | 14 X 20 MM, PLASTIC, TSOP-56 | - |
| 针数 | 64 | 80 | 80 | 56 | 56 | - | 64 | 56 | 56 | - |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | - | unknow | _compli | _compli | - |
| ECCN代码 | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | - | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | - |
| 最长访问时间 | 150 ns | 150 ns | 150 ns | 150 ns | 150 ns | - | 150 ns | 150 ns | 150 ns | - |
| 其他特性 | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | SYNCHRONOUS MODE OF OPERATION ALSO POSSIBLE | SYNCHRONOUS MODE OF OPERATION ALSO POSSIBLE | - | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | - |
| 命令用户界面 | YES | YES | YES | - | - | - | YES | YES | YES | - |
| 通用闪存接口 | YES | YES | YES | - | - | - | YES | YES | YES | - |
| 数据轮询 | NO | NO | NO | - | - | - | NO | NO | NO | - |
| JESD-30 代码 | R-PBGA-B64 | R-PBGA-B80 | R-PBGA-B80 | R-PDSO-G56 | R-PDSO-G56 | - | R-PBGA-B64 | R-PDSO-G56 | R-PDSO-G56 | - |
| JESD-609代码 | e1 | e1 | e1 | - | - | - | e1 | e0 | e0 | - |
| 长度 | 13 mm | 13 mm | 13 mm | - | - | - | 13 mm | 18.4 mm | 18.4 mm | - |
| 内存密度 | 67108864 bi | 67108864 bi | 67108864 bi | 67108864 bi | 67108864 bi | - | 67108864 bi | 67108864 bi | 67108864 bi | - |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | - | FLASH | FLASH | FLASH | - |
| 内存宽度 | 16 | 32 | 32 | 32 | 32 | - | 16 | 16 | 16 | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 | - |
| 部门数/规模 | 64 | 64 | 64 | - | - | - | 64 | 64 | 64 | - |
| 端子数量 | 64 | 80 | 80 | 56 | 56 | - | 64 | 56 | 56 | - |
| 字数 | 4194304 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | - | 4194304 words | 4194304 words | 4194304 words | - |
| 字数代码 | 4000000 | 2000000 | 2000000 | 2000000 | 2000000 | - | 4000000 | 4000000 | 4000000 | - |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - |
| 最高工作温度 | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | - | 85 °C | 85 °C | 70 °C | - |
| 组织 | 4MX16 | 2MX32 | 2MX32 | 2MX32 | 2MX32 | - | 4MX16 | 4MX16 | 4MX16 | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | TBGA | TBGA | TBGA | SOP | SOP | - | TBGA | TSOP1 | TSOP1 | - |
| 封装等效代码 | BGA64,8X8,40 | BGA80,8X10,40 | BGA80,8X10,40 | - | - | - | BGA64,8X8,40 | TSSOP56,.8,20 | TSSOP56,.8,20 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | - | GRID ARRAY, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | - |
| 页面大小 | 4 words | 2/4 words | 2/4 words | - | - | - | 4 words | 4 words | 4 words | - |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | - |
| 电源 | 2/3.3,3.3 V | 2/3.3,3.3 V | 2/3.3,3.3 V | - | - | - | 2/3.3,3.3 V | 2/3.3,3.3 V | 2/3.3,3.3 V | - |
| 编程电压 | 3 V | 3 V | 3 V | 3 V | 3 V | - | 3 V | 3 V | 3 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - |
| 就绪/忙碌 | YES | YES | YES | - | - | - | YES | YES | YES | - |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | - | - | - | 1.2 mm | 1.2 mm | 1.2 mm | - |
| 部门规模 | 1M | 1M | 1M | - | - | - | 1M | 1M | 1M | - |
| 最大待机电流 | 0.000001 A | 0.000001 A | 0.000001 A | - | - | - | 0.000001 A | 0.000001 A | 0.000001 A | - |
| 最大压摆率 | 0.05 mA | 0.05 mA | 0.05 mA | - | - | - | 0.05 mA | 0.05 mA | 0.05 mA | - |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | - |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | - | 3 V | 3 V | 3 V | - |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | - |
| 表面贴装 | YES | YES | YES | YES | YES | - | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | - |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | - | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | - |
| 端子面层 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | - | - | - | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | BALL | BALL | BALL | GULL WING | GULL WING | - | BALL | GULL WING | GULL WING | - |
| 端子节距 | 1 mm | 1 mm | 1 mm | - | - | - | 1 mm | 0.5 mm | 0.5 mm | - |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | DUAL | DUAL | - | BOTTOM | DUAL | DUAL | - |
| 切换位 | NO | NO | NO | - | - | - | NO | NO | NO | - |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | - | NOR TYPE | NOR TYPE | NOR TYPE | - |
| 宽度 | 10 mm | 10 mm | 10 mm | - | - | - | 10 mm | 14 mm | 14 mm | - |
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