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M58LV064A

产品描述64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories
文件大小22KB,共1页
制造商ST(意法半导体)
官网地址http://www.st.com/
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M58LV064A概述

64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories

M58LV064A相似产品对比

M58LV064A M58LV064B150ZA6T M58LV064B150ZA1T M58LV064B150N6T M58LV064B150N1T M58LV064B M58LV064A150ZA6T M58LV064A150ZA1T M58LV064A150N6T M58LV064A150N1T
描述 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories
是否Rohs认证 - 符合 符合 - - - 符合 符合 不符合 不符合
厂商名称 - ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体) - ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体)
零件包装代码 - BGA BGA TSOP TSOP - BGA BGA TSOP TSOP
包装说明 - 10 X 13 MM, 1 MM PITCH, TBGA-80 10 X 13 MM, 1 MM PITCH, TBGA-80 PLASTIC, TSOP-56 PLASTIC, TSOP-56 - 10 X 13 MM, 1 MM PITCH, TBGA-64 10 X 13 MM, 1 MM PITCH, TBGA-64 14 X 20 MM, PLASTIC, TSOP-56 14 X 20 MM, PLASTIC, TSOP-56
针数 - 80 80 56 56 - 64 64 56 56
Reach Compliance Code - unknow unknow unknow unknow - unknow unknow _compli _compli
ECCN代码 - 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A - 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
最长访问时间 - 150 ns 150 ns 150 ns 150 ns - 150 ns 150 ns 150 ns 150 ns
其他特性 - SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS MODE OF OPERATION ALSO POSSIBLE SYNCHRONOUS MODE OF OPERATION ALSO POSSIBLE - SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
命令用户界面 - YES YES - - - YES YES YES YES
通用闪存接口 - YES YES - - - YES YES YES YES
数据轮询 - NO NO - - - NO NO NO NO
JESD-30 代码 - R-PBGA-B80 R-PBGA-B80 R-PDSO-G56 R-PDSO-G56 - R-PBGA-B64 R-PBGA-B64 R-PDSO-G56 R-PDSO-G56
JESD-609代码 - e1 e1 - - - e1 e1 e0 e0
长度 - 13 mm 13 mm - - - 13 mm 13 mm 18.4 mm 18.4 mm
内存密度 - 67108864 bi 67108864 bi 67108864 bi 67108864 bi - 67108864 bi 67108864 bi 67108864 bi 67108864 bi
内存集成电路类型 - FLASH FLASH FLASH FLASH - FLASH FLASH FLASH FLASH
内存宽度 - 32 32 32 32 - 16 16 16 16
功能数量 - 1 1 1 1 - 1 1 1 1
部门数/规模 - 64 64 - - - 64 64 64 64
端子数量 - 80 80 56 56 - 64 64 56 56
字数 - 2097152 words 2097152 words 2097152 words 2097152 words - 4194304 words 4194304 words 4194304 words 4194304 words
字数代码 - 2000000 2000000 2000000 2000000 - 4000000 4000000 4000000 4000000
工作模式 - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 - 85 °C 70 °C 85 °C 70 °C - 85 °C 70 °C 85 °C 70 °C
组织 - 2MX32 2MX32 2MX32 2MX32 - 4MX16 4MX16 4MX16 4MX16
封装主体材料 - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 - TBGA TBGA SOP SOP - TBGA TBGA TSOP1 TSOP1
封装等效代码 - BGA80,8X10,40 BGA80,8X10,40 - - - BGA64,8X8,40 BGA64,8X8,40 TSSOP56,.8,20 TSSOP56,.8,20
封装形状 - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 - GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE SMALL OUTLINE SMALL OUTLINE - GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
页面大小 - 2/4 words 2/4 words - - - 4 words 4 words 4 words 4 words
并行/串行 - PARALLEL PARALLEL PARALLEL PARALLEL - PARALLEL PARALLEL PARALLEL PARALLEL
电源 - 2/3.3,3.3 V 2/3.3,3.3 V - - - 2/3.3,3.3 V 2/3.3,3.3 V 2/3.3,3.3 V 2/3.3,3.3 V
编程电压 - 3 V 3 V 3 V 3 V - 3 V 3 V 3 V 3 V
认证状态 - Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified
就绪/忙碌 - YES YES - - - YES YES YES YES
座面最大高度 - 1.2 mm 1.2 mm - - - 1.2 mm 1.2 mm 1.2 mm 1.2 mm
部门规模 - 1M 1M - - - 1M 1M 1M 1M
最大待机电流 - 0.000001 A 0.000001 A - - - 0.000001 A 0.000001 A 0.000001 A 0.000001 A
最大压摆率 - 0.05 mA 0.05 mA - - - 0.05 mA 0.05 mA 0.05 mA 0.05 mA
最大供电电压 (Vsup) - 3.6 V 3.6 V 3.6 V 3.6 V - 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) - 3 V 3 V 3 V 3 V - 3 V 3 V 3 V 3 V
标称供电电压 (Vsup) - 3.3 V 3.3 V 3.3 V 3.3 V - 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 - YES YES YES YES - YES YES YES YES
技术 - CMOS CMOS CMOS CMOS - CMOS CMOS CMOS CMOS
温度等级 - INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL - INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL
端子面层 - Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) - - - Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 - BALL BALL GULL WING GULL WING - BALL BALL GULL WING GULL WING
端子节距 - 1 mm 1 mm - - - 1 mm 1 mm 0.5 mm 0.5 mm
端子位置 - BOTTOM BOTTOM DUAL DUAL - BOTTOM BOTTOM DUAL DUAL
切换位 - NO NO - - - NO NO NO NO
类型 - NOR TYPE NOR TYPE NOR TYPE NOR TYPE - NOR TYPE NOR TYPE NOR TYPE NOR TYPE
宽度 - 10 mm 10 mm - - - 10 mm 10 mm 14 mm 14 mm

 
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