Microcontroller, 8-Bit, UVPROM, MELPS740 CPU, 8MHz, CMOS, CDIP64
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | SDIP, SDIP64,.75 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 位大小 | 8 |
| CPU系列 | MELPS740 |
| JESD-30 代码 | R-XDIP-T64 |
| JESD-609代码 | e0 |
| 端子数量 | 64 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | -10 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | SDIP |
| 封装等效代码 | SDIP64,.75 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE, SHRINK PITCH |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM(字节) | 256 |
| ROM(单词) | 8192 |
| ROM可编程性 | UVPROM |
| 速度 | 8 MHz |
| 最大压摆率 | 12 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 1.78 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
这份文档是关于三菱电机(MITSUBISHI ELECTRIC)的M50747-XXXSP/FP型号单片8位CMOS微计算机的数据手册。以下是一些值得关注的技术信息:
微计算机特性:
I/O端口:
中断:
定时器:
串行I/O:
电源和时钟:
处理器模式:
电气特性:
绝对最大额定值:
推荐工作条件:
编程注意事项:
数据表:
时序要求:
开关特性:
时序图:
| M50747ES | M50747-146SP | M50747T-XXXSP | M50747EFS | M50747H-XXXSP | M50747H-XXXFP | M50747E-XXXSP | M50747-PGYS | M50747E-XXXFP | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Microcontroller, 8-Bit, UVPROM, MELPS740 CPU, 8MHz, CMOS, CDIP64 | single-chip 8-bit cmos microcomputer | Microcontroller, 8-Bit, MROM, MELPS740 CPU, 2MHz, CMOS, PDIP64 | Microcontroller, 8-Bit, UVPROM, MELPS740 CPU, 8MHz, CMOS, CQFP72 | Microcontroller, 8-Bit, MROM, MELPS740 CPU, 3MHz, CMOS, PDIP64 | Microcontroller, 8-Bit, MROM, MELPS740 CPU, 3MHz, CMOS, PQFP72 | Microcontroller, 8-Bit, UVPROM, MELPS740 CPU, 8MHz, CMOS, PDIP64 | Microcontroller, 8-Bit, EPROM, MELPS740 CPU, 2MHz, CMOS, PDIP64 | Microcontroller, 8-Bit, UVPROM, MELPS740 CPU, 8MHz, CMOS, PQFP72 |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | SDIP, SDIP64,.75 | - | SDIP, SDIP64,.75 | QFP, QFP72,.7X.9,32 | SDIP, SDIP64,.75 | QFP, QFP72,.7X.9,32 | SDIP, SDIP64,.75 | SDIP, SDIP64,.75 | QFP, QFP72,.7X.9,32 |
| Reach Compliance Code | unknown | - | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Is Samacsys | N | - | N | N | N | N | N | N | N |
| 位大小 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | MELPS740 | - | MELPS740 | MELPS740 | MELPS740 | MELPS740 | MELPS740 | MELPS740 | MELPS740 |
| JESD-30 代码 | R-XDIP-T64 | - | R-PDIP-T64 | R-XQFP-G72 | R-PDIP-T64 | R-PQFP-G72 | R-PDIP-T64 | R-PDIP-T64 | R-PQFP-G72 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 64 | - | 64 | 72 | 64 | 72 | 64 | 64 | 72 |
| 最高工作温度 | 70 °C | - | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -10 °C | - | -40 °C | -10 °C | -10 °C | -10 °C | -10 °C | -10 °C | -10 °C |
| 封装主体材料 | CERAMIC | - | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SDIP | - | SDIP | QFP | SDIP | QFP | SDIP | SDIP | QFP |
| 封装等效代码 | SDIP64,.75 | - | SDIP64,.75 | QFP72,.7X.9,32 | SDIP64,.75 | QFP72,.7X.9,32 | SDIP64,.75 | SDIP64,.75 | QFP72,.7X.9,32 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE, SHRINK PITCH | - | IN-LINE, SHRINK PITCH | FLATPACK | IN-LINE, SHRINK PITCH | FLATPACK | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | FLATPACK |
| 电源 | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM(字节) | 256 | - | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| ROM(单词) | 8192 | - | 8192 | 8192 | 8192 | 8192 | 8192 | 16384 | 8192 |
| ROM可编程性 | UVPROM | - | MROM | UVPROM | MROM | MROM | UVPROM | EPROM | UVPROM |
| 速度 | 8 MHz | - | 2 MHz | 8 MHz | 3 MHz | 3 MHz | 8 MHz | 2 MHz | 8 MHz |
| 最大压摆率 | 12 mA | - | 12 mA | 12 mA | 18 mA | 18 mA | 12 mA | 12 mA | 12 mA |
| 标称供电电压 | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | - | NO | YES | NO | YES | NO | NO | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | - | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.78 mm | - | 1.78 mm | 0.8 mm | 1.78 mm | 0.8 mm | 1.78 mm | 1.78 mm | 0.8 mm |
| 端子位置 | DUAL | - | DUAL | QUAD | DUAL | QUAD | DUAL | DUAL | QUAD |
| Base Number Matches | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved