700-mW Mono, Class-AB Audio Amplifier 8-SOIC -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | SOIC-8 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 标称带宽 | 4 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER |
| 谐波失真 | 0.5% |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e4 |
| 长度 | 4.9 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 标称输出功率 | 0.35 W |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大压摆率 | 0.25 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3.9 mm |
| TPA701DG4 | TPA701DGN | TPA701DRG4 | TPA701DR | TPA701DGNR | TPA701DGNG4 | |
|---|---|---|---|---|---|---|
| 描述 | 700-mW Mono, Class-AB Audio Amplifier 8-SOIC -40 to 85 | 700-mW Mono, Class-AB Audio Amplifier 8-MSOP-PowerPAD -40 to 85 | 700-mW Mono, Class-AB Audio Amplifier 8-SOIC -40 to 85 | 700-mW Mono, Class-AB Audio Amplifier 8-SOIC -40 to 85 | 700-mW Mono, Class-AB Audio Amplifier 8-MSOP-PowerPAD -40 to 85 | 700-mW Mono, Class-AB Audio Amplifier 8-MSOP-PowerPAD -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | MSOP | SOIC | SOIC | MSOP | MSOP |
| 包装说明 | SOIC-8 | HTSSOP, TSSOP8,.19 | SOP, SOP8,.25 | SOP, SOP8,.25 | HTSSOP, TSSOP8,.19 | HTSSOP, TSSOP8,.19 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compliant | compli | compliant | compliant | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 标称带宽 | 4 kHz | 4 kHz | 4 kHz | 4 kHz | 4 kHz | 4 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
| 谐波失真 | 0.5% | 0.5% | 0.5% | 0.5% | 0.5% | 0.5% |
| JESD-30 代码 | R-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 4.9 mm | 3 mm | 4.9 mm | 4.9 mm | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 标称输出功率 | 0.35 W | 0.7 W | 0.35 W | 0.35 W | 0.7 W | 0.7 W |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | HTSSOP | SOP | SOP | HTSSOP | HTSSOP |
| 封装等效代码 | SOP8,.25 | TSSOP8,.19 | SOP8,.25 | SOP8,.25 | TSSOP8,.19 | TSSOP8,.19 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.1 mm | 1.75 mm | 1.75 mm | 1.1 mm | 1.1 mm |
| 最大压摆率 | 0.25 mA | 0.25 mA | 0.25 mA | 0.25 mA | 0.25 mA | 0.25 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 0.65 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3.9 mm | 3 mm | 3.9 mm | 3.9 mm | 3 mm | 3 mm |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) |
| 是否无铅 | - | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 |
| Factory Lead Time | - | 1 week | - | 6 weeks | 1 week | 6 weeks |
| 器件名 | 厂商 | 描述 |
|---|---|---|
| TPA701D | Texas Instruments(德州仪器) | 音频功率放大器的类型：Class AB 输出类型：1-Channel (Mono) 工作电压：2.5V ~ 5.5V 输出功率：700mW x 1 @ 8Ω 700mW 低电压音频功率放大器 |
| LM4881M/NOPB | Texas Instruments(德州仪器) | Boomer Dual 200 mW Headphone Amplifier with Shutdown Mode 8-SOIC -40 to 85 |
| TPA701DGNR | Texas Instruments(德州仪器) | 700-mW Mono, Class-AB Audio Amplifier 8-MSOP-PowerPAD -40 to 85 |
| LM4880M/NOPB | Texas Instruments(德州仪器) | Dual 200 mW Audio Power Amplifier with Shutdown Mode 8-SOIC -40 to 85 |
| LM4990ITLX/NOPB | Texas Instruments(德州仪器) | 2 Watt Audio Power Amplifier with Selectable Shutdown Logic Level 9-DSBGA -40 to 85 |
| LM4881MM/NOPB | Texas Instruments(德州仪器) | Boomer Dual 200 mW Headphone Amplifier with Shutdown Mode 8-VSSOP -40 to 85 |
| TPA701DGNG4 | Texas Instruments(德州仪器) | 700-mW Mono, Class-AB Audio Amplifier 8-MSOP-PowerPAD -40 to 85 |
| LM4906MM/NOPB | Texas Instruments(德州仪器) | 1W, Bypass-Capacitor-less Audio Power Amplifier with Internal Selectable Gain 8-VSSOP -40 to 85 |
| TPA6111A2DR | Texas Instruments(德州仪器) | Audio Amp Headphone 2-CH Stereo 0.15W Class-AB 8-Pin SOIC T/R |
| TPA6100A2DGKR | Texas Instruments(德州仪器) | 50-mW Ultra Low-Voltage Stereo Headphone Audio Amplifier 8-VSSOP -40 to 85 |
| LM4902MM/NOPB | National Semiconductor（TI ） | IC 0.675 W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO8, 0.118 INCH, PLASTIC, MSOP-8, Audio/Video Amplifier |
| AD1990ACPZRL | Rochester Electronics | 2 CHANNEL, AUDIO AMPLIFIER, QCC64, 9 X 9 MM, LEAD FREE, MO-220VMMD-4, LFCSP-64 |
| LM4900M/NOPB | Rochester Electronics | 0.675W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO8, SOP-8 |
| TPA6110A2DGNG4 | Texas Instruments(德州仪器) | 150-mW Stereo Headphone Audio Amplifier, Pin Compatible with LM4881 8-MSOP-PowerPAD -40 to 85 |
| LM4893ITL/NOPB | Rochester Electronics | 1.1W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9, MICRO, BUMP, SMD-9 |
| LM4881M/NOPB | Rochester Electronics | 0.3 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8, SOIC-8 |
| TPA6110A2DGNRG4 | Texas Instruments(德州仪器) | 150-mW Stereo Headphone Audio Amplifier, Pin Compatible with LM4881 8-MSOP-PowerPAD -40 to 85 |
| TPA6111A2DRG4 | Texas Instruments(德州仪器) | 150-mW Stereo Headphone Audio Amplifier, Pin Compatible with LM4880 and LM4881 8-SOIC -40 to 85 |
| TPA102DGN | Texas Instruments(德州仪器) | 150-mW Stereo Audio Power Amplifier 8-MSOP-PowerPAD |
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