150-mW Stereo Headphone Audio Amplifier, Pin Compatible with LM4881 8-MSOP-PowerPAD -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | MSOP |
| 包装说明 | HTSSOP, TSSOP8,.19 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 标称带宽 | 20 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER |
| 谐波失真 | 0.1% |
| JESD-30 代码 | S-PDSO-G8 |
| JESD-609代码 | e4 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 2 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 标称输出功率 | 0.15 W |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HTSSOP |
| 封装等效代码 | TSSOP8,.19 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2.5/5.5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大压摆率 | 3 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3 mm |
| Base Number Matches | 1 |
| TPA6110A2DGNG4 | ATS-13B-52-C2-R0 | TPA6110A2DGNRG4 | |
|---|---|---|---|
| 描述 | 150-mW Stereo Headphone Audio Amplifier, Pin Compatible with LM4881 8-MSOP-PowerPAD -40 to 85 | pushPIN HS ASMBLY,FINE-PITCH,STRAIGHT, HOLE PATTERN:LEFT-TABBED,BLUE,T766 | 150-mW Stereo Headphone Audio Amplifier, Pin Compatible with LM4881 8-MSOP-PowerPAD -40 to 85 |
| Brand Name | Texas Instruments | - | Texas Instruments |
| 是否无铅 | 不含铅 | - | 不含铅 |
| 是否Rohs认证 | 符合 | - | 符合 |
| 零件包装代码 | MSOP | - | MSOP |
| 包装说明 | HTSSOP, TSSOP8,.19 | - | HTSSOP, TSSOP8,.19 |
| 针数 | 8 | - | 8 |
| Reach Compliance Code | compli | - | compli |
| ECCN代码 | EAR99 | - | EAR99 |
| Factory Lead Time | 1 week | - | 6 weeks |
| 标称带宽 | 20 kHz | - | 20 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER | - | AUDIO AMPLIFIER |
| 谐波失真 | 0.1% | - | 0.1% |
| JESD-30 代码 | S-PDSO-G8 | - | S-PDSO-G8 |
| JESD-609代码 | e4 | - | e4 |
| 长度 | 3 mm | - | 3 mm |
| 湿度敏感等级 | 1 | - | 1 |
| 信道数量 | 2 | - | 2 |
| 功能数量 | 1 | - | 1 |
| 端子数量 | 8 | - | 8 |
| 最高工作温度 | 85 °C | - | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C |
| 标称输出功率 | 0.15 W | - | 0.15 W |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | HTSSOP | - | HTSSOP |
| 封装等效代码 | TSSOP8,.19 | - | TSSOP8,.19 |
| 封装形状 | SQUARE | - | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | - | 260 |
| 电源 | 2.5/5.5 V | - | 3.3/5 V |
| 认证状态 | Not Qualified | - | Not Qualified |
| 座面最大高度 | 1.1 mm | - | 1.1 mm |
| 最大压摆率 | 3 mA | - | 3 mA |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | - | 2.5 V |
| 表面贴装 | YES | - | YES |
| 技术 | CMOS | - | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | - | GULL WING |
| 端子节距 | 0.65 mm | - | 0.65 mm |
| 端子位置 | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED |
| 宽度 | 3 mm | - | 3 mm |
| Base Number Matches | 1 | - | 1 |
| 器件名 | 厂商 | 描述 |
|---|---|---|
| TPA6110A2DGNR | Texas Instruments(德州仪器) | 150-mW Stereo Headphone Audio Amplifier, Pin Compatible with LM4881 8-HVSSOP -40 to 85 |
| TPA6110A2DGN | Texas Instruments(德州仪器) | 150-mW Stereo Headphone Audio Amplifier, Pin Compatible with LM4881 8-HVSSOP -40 to 85 |
| TPA6110A2DGNRG4 | Texas Instruments(德州仪器) | 150-mW Stereo Headphone Audio Amplifier, Pin Compatible with LM4881 8-MSOP-PowerPAD -40 to 85 |
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| LM4880MX/NOPB | Texas Instruments(德州仪器) | Dual 200 mW Audio Power Amplifier with Shutdown Mode 8-SOIC -40 to 85 |
| LM4881MM/NOPB | Texas Instruments(德州仪器) | Boomer Dual 200 mW Headphone Amplifier with Shutdown Mode 8-VSSOP -40 to 85 |
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| MAX9790BETJ+ | Maxim(美信半导体) | Audio Amplifier, 2W, 2 Channel(s), 1 Func, BICMOS, 5 X 5 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WHHD-2,TQFN-32 |
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| TPA6100A2DGKG4 | Texas Instruments(德州仪器) | 50-mW Ultra Low-Voltage Stereo Headphone Audio Amplifier 8-VSSOP -40 to 85 |
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