700-mW Mono, Class-AB Audio Amplifier 8-SOIC -40 to 85
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | SOIC |
包装说明 | SOP, SOP8,.25 |
针数 | 8 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
标称带宽 | 4 kHz |
商用集成电路类型 | AUDIO AMPLIFIER |
谐波失真 | 0.5% |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e4 |
长度 | 4.9 mm |
湿度敏感等级 | 1 |
信道数量 | 1 |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
标称输出功率 | 0.35 W |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP8,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
最大压摆率 | 0.25 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3.9 mm |
TPA701DRG4 | TPA701DGN | TPA701DR | TPA701DGNR | TPA701DGNG4 | TPA701DG4 | |
---|---|---|---|---|---|---|
描述 | 700-mW Mono, Class-AB Audio Amplifier 8-SOIC -40 to 85 | 700-mW Mono, Class-AB Audio Amplifier 8-MSOP-PowerPAD -40 to 85 | 700-mW Mono, Class-AB Audio Amplifier 8-SOIC -40 to 85 | 700-mW Mono, Class-AB Audio Amplifier 8-MSOP-PowerPAD -40 to 85 | 700-mW Mono, Class-AB Audio Amplifier 8-MSOP-PowerPAD -40 to 85 | 700-mW Mono, Class-AB Audio Amplifier 8-SOIC -40 to 85 |
Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | SOIC | MSOP | SOIC | MSOP | MSOP | SOIC |
包装说明 | SOP, SOP8,.25 | HTSSOP, TSSOP8,.19 | SOP, SOP8,.25 | HTSSOP, TSSOP8,.19 | HTSSOP, TSSOP8,.19 | SOIC-8 |
针数 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | compli | compliant | compliant | compliant | compli | compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
标称带宽 | 4 kHz | 4 kHz | 4 kHz | 4 kHz | 4 kHz | 4 kHz |
商用集成电路类型 | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
谐波失真 | 0.5% | 0.5% | 0.5% | 0.5% | 0.5% | 0.5% |
JESD-30 代码 | R-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 |
JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 |
长度 | 4.9 mm | 3 mm | 4.9 mm | 3 mm | 3 mm | 4.9 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
信道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
标称输出功率 | 0.35 W | 0.7 W | 0.35 W | 0.7 W | 0.7 W | 0.35 W |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | HTSSOP | SOP | HTSSOP | HTSSOP | SOP |
封装等效代码 | SOP8,.25 | TSSOP8,.19 | SOP8,.25 | TSSOP8,.19 | TSSOP8,.19 | SOP8,.25 |
封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.75 mm | 1.1 mm | 1.75 mm | 1.1 mm | 1.1 mm | 1.75 mm |
最大压摆率 | 0.25 mA | 0.25 mA | 0.25 mA | 0.25 mA | 0.25 mA | 0.25 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 0.65 mm | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 3.9 mm | 3 mm | 3.9 mm | 3 mm | 3 mm | 3.9 mm |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - |
Factory Lead Time | - | 1 week | 6 weeks | 1 week | 6 weeks | - |
器件名 | 厂商 | 描述 |
---|---|---|
TPA701D | Texas Instruments(德州仪器) | 音频功率放大器的类型:Class AB 输出类型:1-Channel (Mono) 工作电压:2.5V ~ 5.5V 输出功率:700mW x 1 @ 8Ω 700mW 低电压音频功率放大器 |
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LM4880MX/NOPB | Texas Instruments(德州仪器) | Dual 200 mW Audio Power Amplifier with Shutdown Mode 8-SOIC -40 to 85 |
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TPA122DG4 | Texas Instruments(德州仪器) | 150-mW Stereo Audio Power Amplifier 8-SOIC -40 to 85 |
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