IC GATE DUAL AND-OR DUAL 14DIP
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconductor |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| 制造商包装代码 | SOT27-1 |
| Reach Compliance Code | unknown |
| 其他特性 | ASYMMETRICAL I/P\'S |
| 系列 | HC/UH |
| JESD-30 代码 | R-PDIP-T14 |
| JESD-609代码 | e4 |
| 长度 | 19.025 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | AND-OR GATE |
| 最大I（ol） | 0.004 A |
| 功能数量 | 2 |
| 输入次数 | 6 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2/6 V |
| Prop。Delay @ Nom-Sup | 29 ns |
| 传播延迟（tpd） | 35 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 座面最大高度 | 4.2 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 7.62 mm |
| 74HC58N,652 | LHL08G150K | 74HC58DB,112 | 74HC58D,652 | 74HC58NB | 74HC58D/T3 | 74HC58DB,118 | 74HC58D,653 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC GATE DUAL AND-OR DUAL 14DIP | RADIAL LEADED INDUCTORS | IC dual and-OR gate 14-ssop | IC dual and-OR gate 14-soic | IC HC/UH SERIES, DUAL 6-INPUT AND-OR GATE, PDIP14, Gate | IC HC/UH SERIES, DUAL 6-INPUT AND-OR GATE, PDSO14, SOP-14, Gate | IC GATE AND-OR DUAL 14SSOP | IC GATE AND-OR DUAL 14SOIC |
| Brand Name | NXP Semiconductor | - | NXP Semiconduc | NXP Semiconduc | - | - | NXP Semiconductor | NXP Semiconductor |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | - | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | DIP | - | SSOP1 | SOIC | - | SOIC | SSOP1 | SOIC |
| 包装说明 | DIP, DIP14,.3 | - | SSOP-14 | SOP, SOP14,.25 | DIP, | SOP, | SSOP-14 | SOP, SOP14,.25 |
| 针数 | 14 | - | 14 | 14 | - | 14 | 14 | 14 |
| 制造商包装代码 | SOT27-1 | - | SOT337-1 | SOT108-1 | - | - | SOT337-1 | SOT108-1 |
| Reach Compliance Code | unknown | - | unknow | unknow | unknown | unknown | unknown | unknown |
| 其他特性 | ASYMMETRICAL I/P\'S | - | ASYMMETRICAL I/P\'S | ASYMMETRICAL I/P\'S | ASYMMETRICAL I/P\'S | ASYMMETRICAL I/PS | ASYMMETRICAL I/P\'S | ASYMMETRICAL I/P\'S |
| 系列 | HC/UH | - | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 代码 | R-PDIP-T14 | - | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609代码 | e4 | - | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 19.025 mm | - | 6.2 mm | 8.65 mm | 19.025 mm | 8.65 mm | 6.2 mm | 8.65 mm |
| 负载电容（CL） | 50 pF | - | 50 pF | 50 pF | 50 pF | - | 50 pF | 50 pF |
| 逻辑集成电路类型 | AND-OR GATE | - | AND-OR GATE | AND-OR GATE | AND-OR GATE | AND-OR GATE | AND-OR GATE | AND-OR GATE |
| 功能数量 | 2 | - | 2 | 2 | 2 | 2 | 2 | 2 |
| 输入次数 | 6 | - | 6 | 6 | 6 | 6 | 6 | 6 |
| 端子数量 | 14 | - | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | - | SSOP | SOP | DIP | SOP | SSOP | SOP |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | - | 260 | 260 | 245 | - | 260 | 260 |
| 传播延迟（tpd） | 35 ns | - | 35 ns | 35 ns | 35 ns | 35 ns | 35 ns | 35 ns |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.2 mm | - | 2 mm | 1.75 mm | 4.2 mm | 1.75 mm | 2 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 6 V | - | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | - | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | - | YES | YES | NO | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | THROUGH-HOLE | - | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | - | 0.65 mm | 1.27 mm | 2.54 mm | 1.27 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | - | 30 | 30 | 40 | - | 30 | 30 |
| 宽度 | 7.62 mm | - | 5.3 mm | 3.9 mm | 7.62 mm | 3.9 mm | 5.3 mm | 3.9 mm |
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