IC HC/UH SERIES, DUAL 4-INPUT NAND GATE, PDSO14, SOT-108-1, SOP-14, Gate
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| 系列 | HC/UH |
| JESD-30 代码 | R-PDSO-G14 |
| JESD-609代码 | e4 |
| 长度 | 8.65 mm |
| 逻辑集成电路类型 | NAND GATE |
| 功能数量 | 2 |
| 输入次数 | 4 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 传播延迟（tpd） | 27 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 3.9 mm |
| Base Number Matches | 1 |
| 74HC20D/T3 | 74HC20DB-T | 74HC20PW | 74HCT20DB | 74HCT20NB | 74HC20NB | |
|---|---|---|---|---|---|---|
| 描述 | IC HC/UH SERIES, DUAL 4-INPUT NAND GATE, PDSO14, SOT-108-1, SOP-14, Gate | 门（与/非与/或/非或） dual 4-input nand gate | 门（与/非与/或/非或） dual 4-input nand gate | 门（与/非与/或/非或） dual 4-input nand gate | HCT SERIES, DUAL 4-INPUT NAND GATE, PDIP14 | HC/UH SERIES, DUAL 4-INPUT NAND GATE, PDIP14 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | SOP, | SOT-337-1, SSOP-14 | TSSOP, TSSOP14,.25 | SOT-337-1, SSOP-14 | DIP, | DIP, |
| Reach Compliance Code | unknown | unknow | compli | unknow | unknown | unknown |
| 系列 | HC/UH | HC/UH | HC/UH | HCT | HCT | HC/UH |
| JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 | R-PDIP-T14 |
| 长度 | 8.65 mm | 6.2 mm | 5 mm | 6.2 mm | 19.025 mm | 19.025 mm |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 输入次数 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SSOP | TSSOP | SSOP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | IN-LINE | IN-LINE |
| 传播延迟（tpd） | 27 ns | 27 ns | 27 ns | 42 ns | 42 ns | 27 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 2 mm | 1.1 mm | 2 mm | 4.2 mm | 4.2 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 5.5 V | 5.5 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 4.5 V | 4.5 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 3.9 mm | 5.3 mm | 4.4 mm | 5.3 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 零件包装代码 | SOIC | SSOP | TSSOP | SSOP | - | - |
| 针数 | 14 | 14 | 14 | 14 | - | - |
| JESD-609代码 | e4 | e4 | e4 | e4 | - | e4 |
| 端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - | NICKEL PALLADIUM GOLD |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | - | 符合 |
| 负载电容（CL） | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | - | 245 |
| 处于峰值回流温度下的最长时间 | - | 30 | 30 | 30 | - | 40 |
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